Array substrate, display device and method for manufacturing array substrate

Abstract

The invention discloses an array substrate which comprises an array region and an attaching region. The array region comprises grid lines, data lines and array units which are limited by the grid lines and the data lines in a crossing mode. The attaching region comprises first attaching units located on the end portions of the data lines and electrically connected with the data lines. The array substrate is characterized in that a second attaching unit electrically connected with one grid line is arranged between at least one pair of adjacent first attaching units. Due to the fact that the second attaching unit electrically connected with the grid line is arranged between the at least one pair of adjacent first attaching units, the height difference between the attaching units in the attaching region and non-attaching units in the attaching region is reduced, and the product percent of pass is improved. The array substrate can further enable the length of the attaching units to be decreased on the premise that the attaching area of the attaching region is not decreased, and the requirements for narrow frame deign are met. The invention further provides a display device based on the array substrate and a method for manufacturing the array substrate.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a display device and a method for manufacturing the array substrate. Background technique [0002] In recent years, with the development of science and technology, liquid crystal display technology has also been continuously improved. TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Field Effect Transistor-Liquid Crystal Display) occupies an important position in the display field due to its advantages of good image display quality, low energy consumption, and environmental protection. In the process of display design and manufacturing, the frame of its design is getting narrower and narrower, so that the space of the bonding area where the array substrate of the display device is connected to the printed circuit board is getting smaller and smaller. If the length of the bonding unit in the bonding area is reduced, the The lamination a...

AI Technical Summary

Problems solved by technology

In the process of display design and manufacturing, the frame of its design is getting narrower and narrower, so that the space of the bonding area where the array substrate of the display device is connected to the printed circuit board is getting smaller and smaller. If the length of the bonding unit in the bonding area is reduced, the It will reduce the bonding area of ​​the bonding unit, which will lead to insufficient charging rate of the LCD panel, resulting in many poor display problems

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