Method for rapidly achieving solidification falling welding of satellite-borne software program at low risk

Abstract

A method for rapidly achieving solidification falling welding of a satellite-borne software program at a low risk comprises the steps of respectively independently designing printed boards for an electrically-erasable programmable read-only memory (EEPROM), a programmable read-only memory (PROM), an application memory and other peripheral devices, and inserting an EEPROM memory board in a main circuit board through a pluggable interconnection plug-in at a program debugging stage; when the program debugging is finished and the program needs to undergo solidification falling welding, enabling finally solidified software to be burned in the PROM, enabling the well burned PROM to be welded to a PROM memory board, pulling out the EEPROM memory board on the main circuit board, enabling the PROM memory board to be plugged in the main circuit board through a pluggable interconnection plug-in, and finally enabling the main circuit board with the program having undergone solidification falling welding to enter the space to be used. According to the method, the development cost is reduced, system dismantling and installing operation during software program solidification is omitted, the technical risk and hidden danger are avoided, system reliability is improved, program solidification time is shorted, the development cycle is shorted, the program solidification risk is reduced, and system reliability and availability are improved.

Description

technical field [0001] The invention relates to the aerospace field, in particular to a low-risk and fast method for solidifying and dropping welding of on-board software programs. Background technique [0002] At present, most on-board software products run on chips based on Static Random-access memory (SRAM) technology, and chips based on SRAM technology are volatile devices, and configuration data will be lost after power-off. After each power-on, the data stored in the external memory needs to be recalled to reconfigure the data. In the process of software ground debugging, the external memory generally uses Electrically Erasable Programmable Read-Only Memory (EEPROM). EEPROM can be programmed and erased multiple times, which is convenient for software debugging and Change. Due to the harshness of the satellite working environment, it is required that the data stored in the external memory will not change due to factors such as the environment during the entire satelli...

AI Technical Summary

Problems solved by technology

Such system disassembly and assembly operations bring technical risks, reduce reliability, and require additional environmental tests, prolonging the development cycle and increasing development costs, and the EEPROM after disassembly and welding can no longer be used, resulting in a waste of resources , cost increase

In addition, if the program needs to be changed after the program is solidified, the PROM memory needs to be replaced, so that the PROM pads have to undergo soldering, desoldering and secondary soldering, which not only greatly increases the cost, but also reduces the reliability of the product. Only secondary soldering is allowed. Once the secondary soldering fails, the entire printed board and other components on it will be scrapped, and the risk is extremely high

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