Electromagnetic interference prevention overvoltage protection device

Abstract

The invention discloses an electromagnetic interference prevention overvoltage protection device. The device comprises a semiconductor packaging framework and an overvoltage protection chip arranged on the semiconductor packaging framework. The device is characterized in that the overvoltage protection chip is three P-N junctions so as to form a double-end four-layer bidirectional symmetrical structure; each group is successively doped with N2, P2, N1 and P1 four layer overvoltage protection circuits from top to bottom and is connected in series with a low capacitance surge protector and an electromagnetic interference suppression circuit. As an improvement, a carrier of the semiconductor framework is provided with a convex point seat which is mutually and electrically connected with a pedestal. The convex point seat is connected with the semiconductor overvoltage protection chip so that a right side of the chip is connected with a pin on the semiconductor framework through using a lead. The device of the invention has the advantages that the structure is simple; usage is reliable; surge prevention and electromagnetic interference prevention functions are possessed.

Description

technical field [0001] The invention relates to an overvoltage protection device, in particular to an overvoltage protection device for preventing electromagnetic interference. Background technique [0002] In the field of communications, unexpected voltage surges due to inductive and capacitive transients, electrostatic discharge, lightning and other reasons will cause the performance of the whole system to decline, malfunction or even damage. Protection has become an important part of improving the reliability of the whole machine system. [0003] In the prior art, a combination of several voltage transient and surge protection devices is used to form a multi-pole protection device, and the most commonly used overvoltage protection device for semiconductor protection devices is packaged The frame and the semiconductor protection chip set on it are composed. The connection between the semiconductor protection chip and the packaging frame is to bond the chip to the base of ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the combination of several voltage transient and surge protection devices to form a multi-pole protection device has been widely used. Among them, the most commonly used overvoltage protection device for semiconductor protection devices is packaged It consists of a frame and a semiconductor protection chip on it. The connection between the semiconductor protection chip and the packaging frame is to bond the chip to the base of the frame with conductive adhesive; If it is pressed out, there will be a short circuit phenomenon on the front and back of the chip, the yield rate is low, and the product quality is unreliable

In addition, such devices often do not have surge protection and EMI immunity, limiting the use of the device

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