Novel electromagnetic shielding piezoelectric interlayer

Abstract

The invention discloses a novel electromagnetic shielding piezoelectric interlayer. The novel electromagnetic shielding piezoelectric interlayer comprises a flexible printed circuit board, a piezoelectric sensor and an SMA interface, wherein the piezoelectric sensor is pasted on one side of the flexible printed circuit board, the SMA interface is fixedly connected to the other side of the flexible printed circuit board, and an insulating film is laid on the reverse side of the fixed connection position. According to the technical scheme, the novel electromagnetic shielding piezoelectric interlayer improves the resistance to high frequency electromagnetic interference, weakens crosstalk of signals in an adjacent piezoelectric interlayer, increases the signal to noise ratio of the signals, improves the reliability and consistency, enhances the coupling efficiency between the piezoelectric sensor and a structure, ensures the stimulation performance and sensor capability of the piezoelectric sensor, and boosts the wide application to astronautic structure health monitoring.

Description

technical field [0001] The invention relates to a piezoelectric interlayer, in particular to a novel electromagnetic shielding piezoelectric interlayer, which belongs to the technical field of piezoelectric sensor packaging and is applied in the field of aerospace structure health monitoring. [0002] Background technique [0003] Aerospace structures need to withstand environmental loads such as temperature changes and particle radiation during in-orbit operation. With the increasing pollution of space, aerospace structures are vulnerable to impacts from space debris, and structural safety is seriously threatened. In order to monitor the integrity and safety of aerospace structures, prolong service life and reduce maintenance costs, structural health monitoring technology has received more and more research and attention in the aerospace field. Structural health monitoring technology refers to the use of structurally arranged sensor arrays to regularly collect structural d...

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to overcome the defects that the existing piezoelectric interlayer is susceptible to electromagnetic interference and low reliability when working in the environment of high-frequency radiation of aerospace structures, and to provide a piezoelectric interlayer that can be applied to aerospace structures, It can enhance the anti-electromagnetic interference ability of the piezoelectric interlayer and improve the reliability of the application of the piezoelectric interlayer in aerospace structures

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