A multi-stage water cooling device for electronic devices

A technology of electronic devices and water-cooling devices, which is applied in the field of multi-stage water-cooling devices for electronic devices, can solve the problems of threats to electrical components, heavy workload, cumbersome process, etc., and achieve the effect of convenient maintenance and operation

Active Publication Date: 2016-05-25
CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the water in the pipeline is not drained before the connector is plugged and unplugged during operation, it is easy to cause liquid seepage, which will pose a huge threat to electrical components
However, if the water in the entire heat dissipation system is drained just to replace a device, the workload is very large, and the cumbersome process is obvious.

Method used

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  • A multi-stage water cooling device for electronic devices
  • A multi-stage water cooling device for electronic devices
  • A multi-stage water cooling device for electronic devices

Examples

Experimental program
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Embodiment Construction

[0028] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] see figure 1 , which is a structural block diagram of the first embodiment of the multi-stage water cooling device for electronic devices provided by the present invention.

[0030] In this embodiment, it includes: a main pipeline 101 , a branch valve 102 , a branch pipeline 103 and a branch water-cooling radiator 104 .

[0031] The main pipeline 101 is connected to the branch pipeline 103 through the branch valve 102, and is used to deliver the cooling fluid to the branch pipeline 103 for heat dissipation.

[0032] The branch valve 102 connects the main pipeline 101 and the branch pipeline 103 and is used for controlling the connection or disconnection of the main pipeline 101 and the branch pipeline 103 .

[0033] The branch...

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PUM

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Abstract

The invention provides a multi-stage water-cooling device of an electronic device. The water-cooling device comprises a main pipeline, branch valves, branch pipelines and branch water cooler, wherein the main pipeline is connected with the branch pipelines through the branch valves, so as to realize that cooling fluid is conveyed to the branch pipelines for cooling; the branch valves are connected with the main pipeline and the branch pipelines and used for controlling the on / off of the main pipeline and the branch pipelines; the branch pipelines are connected with the branch valves and the branch cooler and used for conveying the heat of the water cooler into the main pipeline for cooling through the cooling fluid; the branch water coolers are connected with the branch pipelines and used for conducting the heat of the electronic devices into the cooling fluid. Due to the adoption of the water cooling device, segmentation control for the branch water cooling of the electronic device system and the water cooling system is realized, so as to bring convenience in maintaining and operating the pipelines.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a multi-stage water cooling device for electronic devices. Background technique [0002] With the rapid development of electronic device integration technology and the continuous innovation of electronic devices, the structure of today's electronic devices is becoming more and more compact, and the power level is getting higher and higher. However, with the large-scale use of electronic devices, the problem of heat dissipation has gradually become prominent. [0003] Existing electronic devices adopt traditional air-cooling or water-cooling heat dissipation methods in actual use, but these two methods also have certain disadvantages. [0004] When using air-cooled heat dissipation, because some electronic devices generate relatively large amounts of heat, it is difficult to dissipate the heat in time only by the air-cooled radiator alone, resulting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 胡家喜姚磊杨进锋刘海涛李彦涌孙保涛向言丰张文进武丹
Owner CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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