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Printed circuit board

A technology of printed circuit boards and circuit boards, which is applied in the direction of printed circuit components, electrical connection printed components, etc., can solve the problems of high production testing costs and after-sales costs, unreliable connections, and poor reliability of printed circuit board products. Achieve the effects of low production inspection cost and after-sales cost, reliable connection, and reliable and stable connection

Active Publication Date: 2013-10-23
HUAQIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the unreliable connection of the electronic structural material on the printed circuit board in the prior art, the poor reliability of the printed circuit board product, the production test cost and after-sales cost of the printed circuit board product. The defect of high cost provides a printed circuit board with electronic structural materials that are not easy to desolder and components are firmly connected

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] In this example, see figure 1 , a printed circuit board, which includes 8 layers of circuit boards, each layer of circuit boards includes a layer of substrate 12 and a layer of copper pads 13, the printed circuit board includes two for connecting printed circuit boards The via holes of all the circuit boards, that is, the via holes are through holes 11, and the shape of the through holes 11 is the shape presented when two tapered cone tops are butted. One end of the through hole 11 is connected to the component pad 15 of the electronic structural material 14 mounted on the printed circuit board.

[0032] The through hole 11 includes a conductive medium, the conductive medium has a larger contact area with each layer of the circuit board, and the conductive medium connects the component pad 15 so that the electronic structural material 14 is more firmly connected to the printed circuit board.

[0033] When the electronic structural material 14 is subjected to downward p...

Embodiment 2

[0037] see figure 2 , this embodiment is basically the same as Embodiment 1, the only difference is that the shape of the through hole 11 is the shape presented when two tapered apexes are butted, and the shapes of the two tapered shapes are the same.

[0038] The shape of the through hole 11 is symmetrical, which is not only convenient to manufacture, but also more uniform when the force is applied, that is, the area of ​​the force receiving surface is the same regardless of the downward force or the upward force. The connection between the printed circuit board and the electronic structural material 14 on it is more reliable.

Embodiment 3

[0040] see image 3 , this embodiment is basically the same as Embodiment 2, except that both ends of the through hole 11 are connected to the component pads 15 of the electronic structural material 14 mounted on the printed circuit board. The through hole 11 connects two component pads 15 . Can meet the different needs of printed circuit boards.

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Abstract

The invention discloses a printed circuit board which comprises a plurality of layers of circuit board bodies. The printed circuit board comprises at least one via hole used for being connected with the portions, at the end portion of the printed circuit board, of the layers of circuit board bodies. The via hole is in a two-cone shape, wherein the two cones are in butt joint. According to the printed circuit board, the electronic structure materials are firm and stable in connection and not prone to unsoldering, a product with the printed circuit board is better in quality, and the production testing cost of the product and the after-sale cost are low.

Description

technical field [0001] The invention relates to a printed circuit board. Background technique [0002] The Chinese name of PCB (Printed Circuit Board) is a printed circuit board, which is a support for important electronic components and electronic components, and a provider of circuit connections for electronic components. According to the number of layers of circuit boards, printed circuit boards can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. With the development of electronic manufacturing technology, more and more electronic products use SMT (Surface Mount Process) to complete the production of PCB motherboards of electronic products. [0003] SMT can greatly improve the production efficiency of motherboards, but it also brings disadvantages that cannot be ignored. For example, when installing some electronic structural materials with high stress, there are often problems of unrelia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
Inventor 易伟
Owner HUAQIN TECH CO LTD
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