Heat-dissipation component of server

A heat dissipation component and server technology, applied in the direction of instruments, digital data processing components, electrical digital data processing, etc., can solve the problems of limited fan size and quantity, unfavorable server chassis miniaturization, and affecting the service life of server chassis, etc., to achieve Miniaturization, direct and rapid heat dissipation

Inactive Publication Date: 2013-10-23
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the heat dissipation of the server chassis is mainly realized by its own internal fan. However, in order to meet the needs of high integration and miniaturization, the design of each component inside the server chassis is becoming more and more compact, which limits the fan installed in it. size and quantity
If the server chassis is equipped with multiple fans to ensure its internal heat dissipation, it is not conducive to the miniaturization of the server chassis; but if the number of fans installed in the server chassis is insufficient, the heat dissipation effect of the server chassis cannot be guaranteed, and it is easy to affect the service life of the server chassis
In addition, the heat generated by some electronic components with high power consumption in the server case is relatively concentrated, while the fan of the traditional server case is concentratedly installed at one end of the server case, which is not conducive to timely cooling of the position where the heat is concentrated.

Method used

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  • Heat-dissipation component of server
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Examples

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Embodiment Construction

[0011] see figure 1 , a preferred embodiment of the present invention provides a server heat dissipation assembly 100 , including a server chassis 10 , a heat dissipation unit 20 and at least one connection unit 30 . The server chassis 10 is installed in a cabinet (not shown). In this embodiment, the connection unit 30 is an air duct, the two ends of which are respectively connected to the server chassis 10 and the cooling unit 20 , and the connection unit 30 extends from the inside of the cabinet to the outside of the cabinet. The cooling unit 20 is located outside the cabinet and is used for cooling the server chassis 10 .

[0012] Please also refer to figure 1 and figure 2 , the server chassis 10 is a hollow box body, including a relative front end 12, a rear end 14 and an upper cover 16, and a plurality of electronic components 18 can be installed at intervals inside it. In this embodiment, the plurality of electronic components 18 are server Electronic components wit...

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Abstract

A heat-dissipation component of a server comprises a server case, wherein the server case is internally equipped with a plurality of electronic elements at intervals, and a plurality of openings are formed in positions, corresponding to the electronic elements, on the server case. The heat-dissipation component of the server further comprises a heat-dissipation unit and at least one connection unit. The heat-dissipation unit comprises a plurality of interfaces and an exhaust fan; the at least one connection unit is connected with the at least one opening and the at least one interface respectively; and the exhaust fan draws heat out of the server case through the connection units to cool the server case.

Description

technical field [0001] The invention relates to a computer system server, in particular to a server cooling assembly. Background technique [0002] At present, the heat dissipation of the server chassis is mainly realized by its own internal fan. However, in order to meet the needs of high integration and miniaturization, the design of each component inside the server chassis is becoming more and more compact, which limits the fan installed in it. size and quantity. If the server chassis is equipped with multiple fans to ensure its internal heat dissipation, it is not conducive to the miniaturization of the server chassis; but if the number of fans installed in the server chassis is insufficient, the heat dissipation effect of the server chassis cannot be guaranteed, and it is easy to affect the service life of the server chassis . In addition, the heat generated by some electronic components with high power consumption in the server case is relatively concentrated, while ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
Inventor 张耀廷
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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