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Ultrasonic-assisted local metallizing method on surface of ceramic

A ceramic surface and metallization technology, applied in the field of ceramic surface metallization, can solve the problems of high equipment cost, time-consuming, complicated process, etc., and achieve the effect of wide range of metals and cost reduction.

Inactive Publication Date: 2013-10-09
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The present invention aims to solve the technical problems of high equipment cost, complex process, long time consumption and few types of metallization raw materials in the existing ceramic surface local metallization method, thereby providing an ultrasonic-assisted ceramic surface local metallization method

Method used

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  • Ultrasonic-assisted local metallizing method on surface of ceramic
  • Ultrasonic-assisted local metallizing method on surface of ceramic
  • Ultrasonic-assisted local metallizing method on surface of ceramic

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specific Embodiment approach 1

[0033] Embodiment 1: In this embodiment, a method for ultrasonically assisted local metallization of ceramic surfaces is carried out in the following steps:

[0034] 1. Ultrasonic cleaning the surface of the ceramic substrate to be metallized with deionized water for 8 minutes to 12 minutes to obtain a clean ceramic substrate to be metallized;

[0035] Two, the pre-cutting volume is the metallized raw material of V, the area of ​​the ceramic substrate surface to be metallized that is obtained in step 1 is X, and the clean ceramic substrate surface to be metallized that is obtained in step 1 is to be treated as X. The thickness of the pre-plated metal layer in the metallization area is Y, then: V=X·Y;

[0036] 3. Put the clean ceramic substrate to be metallized in the fixture plate, and then use high-frequency induction heating or resistance heating to heat the clean ceramic substrate to be metallized, and heat the clean ceramic substrate to be metallized to 20° C. to 100° C. ...

specific Embodiment approach 2

[0044] Embodiment 2: This embodiment differs from Embodiment 1 in that: in step 3, the cleaned ceramic substrate to be metallized is heated to 30° C. to 70° C. above the melting point of the metallization raw material described in step 2. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0045] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that in step 4, when the surface area of ​​the cleaned ceramic substrate to be metallized is less than or equal to 9×10 4 mm 2 When , the ultrasonic action mode of the single acoustic pole is used for ultrasound. Others are the same as those in the first or second embodiment.

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Abstract

The invention discloses an ultrasonic-assisted local metallizing method on the surface of ceramic, and relates to methods for metallizing the surface of the ceramic. The method disclosed by the invention aims to solve the problem that existing methods for metallizing the surface of the ceramic is high in equipment cost, complex in process, time-consuming and less type of metallizing raw materials. The method disclosed by the invention comprises the following steps of: 1, ultrasonically cleaning a ceramic substrate to be metallized; 2, pre-cutting the metallizing raw material; 3, heating and melting the metallized material; and 4, performing ultrasonic treatment. The method disclosed by the invention can be applied to the fields such as electronic industry and ceramic materials.

Description

technical field [0001] The invention relates to a method for metallizing ceramic surfaces. Background technique [0002] Ceramic materials have been widely used because of their advantages such as high temperature resistance, corrosion resistance, wear resistance, and high hardness. However, in some special engineering applications, such as the electronics industry and the application of ceramic materials, the surface must first be metallized, and then connected with metal leads or conductive layers to realize the integration of electronic circuits. The traditional process of ceramic surface metallization requires long-term heating treatment in a high-temperature furnace under the protection of reducing gas. At present, the commonly used ceramic surface metallization methods mainly include coating, vacuum coating, chemical coating, immersion coating and the combination of various methods. [0003] Chinese patent 200410018367.2 provides a method for metallizing the surface ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88
Inventor 许志武马琳黎华栋
Owner HARBIN INST OF TECH
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