Electronic device encapsulated with welding end ring and electronic equipment provided with electronic device

Abstract

The invention is suitable for the technical field of electronic devices and discloses an electronic device encapsulated with a welding end ring and electronic equipment provided with the electronic device. The electronic device comprises a body and the welding end ring, wherein the welding end ring is sleeved on the outer periphery wall of the body and provided with a plane welding end, and the plane welding end is flush with or extrudes out of the outer periphery wall. The electronic equipment comprises a circuit board and the electronic device encapsulated with the welding end ring, wherein a welding pad is arranged on the circuit board, and the plane welding end of the electronic device is welded on the welding pad. According to the electronic device encapsulated with the welding end ring and the electronic equipment provided with the electronic device, as the plane welding end which is flush with or extrudes out of the body is arranged, when the plane welding end is welded on the circuit board, cracks are not easy to generate at a welding spot, stress concentration is reduced, the expandable path of the cracks also becomes larger, so that the electronic device and the electronic equipment do not easily lose efficacy and are high in reliability.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and in particular relates to an electronic device packaged with a solder end ring and electronic equipment with the electronic device. Background technique [0002] Current electronic devices, such as MELF packaged devices, generally have a cylindrical soldering end, which is flush with the body, and the soldering end is in line contact with a pad of a PCB (Printed Circuit Board, printed circuit board), and the contact area is small. When this type of device in the prior art is soldered on the PCB, the height of the solder paste climbing along the soldering end is small, resulting in a small amount of tin at the soldering end. Since the body is ceramic, it does not match the CTE (Coefficient of Thermal Expansion, coefficient of thermal expansion) of the PCB, and the small amount of tin at the soldering end does not play a good role in reducing the mismatch of CTE, so in long-term opera...

AI Technical Summary

Problems solved by technology

When this type of device in the prior art is soldered on the PCB, the height of the solder paste climbing along the soldering end is small, resulting in a small amount of tin at the soldering end

Since the body is ceramic, it does not match the CTE (Coefficient of Thermal Expansion, coefficient of thermal expansion) of the PCB, and the small amount of tin at the soldering end does not play a good role in reducing the mismatch of CTE, so in long-term operation , the solder joints are prone to cracks, which cannot meet the long-term reliability requirements of the product

Moreover, the stress on the solder joint at the soldering end is high and cracks are likely to appear, and the crackable expansion path is small, which is prone to early failure and poor product reliability.

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