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Highly filled epoxy resin glue liquid suitable for laminated board and preparation method thereof

A technology of epoxy resin glue and high filler, which is applied in the field of high filler epoxy resin glue and its preparation, which can solve the problems of reducing the viscosity and fluidity of the resin, drying up the molding, and difficulty in infiltrating the glue, so as to ensure the dispersion effect, The effect of improving liquidity and reducing consumption

Active Publication Date: 2015-04-08
江西省宏瑞兴科技股份有限公司
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AI Technical Summary

Problems solved by technology

[0002] In the traditional epoxy resin glue system, the weight average molecular weight of the epoxy resin used is generally between 3000-3500, and the molecular weight distribution is relatively uniform. It is relatively wide and easy to control. Its disadvantage is that the proportion of inorganic fillers should not be too high, because the addition of fillers will reduce the viscosity and fluidity of the resin, so the general filling proportion does not exceed 70% (compared to resin), Otherwise, it is difficult for the glue to infiltrate when the reinforcing material is dipped, which will affect the fluidity of the press, cause the molded product to dry up, and the filler cannot be completely wetted and covered

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment one Embodiment two Embodiment three

[0015] E-51 resin 50 80 100

[0016] E-12 resin 50 20 0

[0017] Dicyandiamide 3.85 4.20 4.06

[0018] Diaminodiphenylmethane 0 2.48 5.15

[0019] Dimethylimidazole 0.04 0.05 0.06

[0020] Magnesium hydroxide 70 120 180

[0021] Microsilica 10 10 20

[0022] Complex barium sulfate 10 20 50

[0023] Boron Nitride / AlN 10 30 50

[0024] Dimethylformamide 50 70 100

[0025] Silane coupling agent 2 3.6 6;

[0026] Its preparation method is as follows:

[0027] 1. Inject the solvent into the dissolution kettle at a constant temperature of 40-50°C, slowly pour in the E-12 resin under stirring conditions, and stir for 7-8 hours. Take a sample from the bottom of the kettle and observe that there are no obvious particles. Dissolution ratio The resin / solvent ratio is 7:3 or 6:4;

[0028] 2. Inject the solvent into the dissolution kettle at room temperature first, pour in the catalyst and curing agent...

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Abstract

The invention relates to a highly filled epoxy resin glue liquid suitable for a laminated board. The glue liquid is prepared from the following raw materials: E-51 resin, E12 resin, dicyandiamide, diaminodiphenyl-methane, dimethylimidazole, magnesium hydrate, silica powder, compound barium sulfate, boron nitride / aluminum nitride, dimethylformamide and a silane coupling agent. According to the highly filled epoxy resin glue liquid suitable for the laminated board, the main resin of the composite resin system is low molecular epoxy resin and a small amount of high molecular resin is used for adjusting mobility, so that the mobility of the resin system is improved. Two curing agents with reactive differences are used to control flowing deformation of low molecular epoxy resin. The multi-component compound filler system brings compound performances such as excellent flame retardancy, heat conduction, insulation, rigidity and the like; since filling proportion of inorganic filler to the glue liquid is very high, the cost is lowered; and the dispersion effect of the filler is ensured due to the adoption of high-speed shearing or emulsifying technology.

Description

technical field [0001] The invention relates to a high-fill epoxy resin glue suitable for laminated boards and a preparation method. Background technique [0002] In the traditional epoxy resin glue system, the weight average molecular weight of the epoxy resin used is generally between 3000-3500, and the molecular weight distribution is relatively uniform. It is relatively wide and easy to control. Its disadvantage is that the proportion of inorganic fillers should not be too high, because the addition of fillers will reduce the viscosity and fluidity of the resin, so the general filling proportion does not exceed 70% (compared to resin), Otherwise, it will be difficult for the glue to infiltrate when the reinforcing material is dipped in glue, which will affect the fluidity of the press, cause the molded product to dry up, and the filler cannot be completely wetted and covered. Contents of the invention [0003] The purpose of the present invention is to provide a kind ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K13/02C08K3/22C08K3/38C08K3/28C08K3/36C08K3/30C08G59/50
Inventor 曾昭峰彭家灯
Owner 江西省宏瑞兴科技股份有限公司
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