Full-page printed wiring board
A technology for printed circuit boards and circuit boards, which is applied in the directions of printed circuit components and structural connections of printed circuits.
Inactive Publication Date: 2013-07-24
ZHEJIANG KAIHUA JIANKE ELECTRONICS TECH
View PDF2 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] At present, in the production process of printed circuit boards, the intermediate process is full-page production, that is, a full-page printed circuit board includes several circuit boards, and then each circuit board is separated by a V-CUT machine, so that , there are many processes, and there will be a lot of burrs on the edge of the division
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0009] The present invention will be further described below in conjunction with specific examples.
[0010] refer to figure 1 Each circuit board 1 of the full-page printed circuit board is connected through a connection position 2, and the connection position 2 and the circuit board 1 are connected through a stamp hole 3. In this way, the purpose of easily dividing the boards between each circuit board is achieved through the stamp holes, which is fast and convenient, and reduces the process.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a full-page printed wiring board. Wiring boards of the full-page printed wiring board are connected through link bits; and the link bits and the wiring boards are connected through stamp holes. By the full-page printed wiring board, the aim of easily separating the wiring boards through the stamp holes can be achieved, quickly and conveniently, and working procedures are reduced.
Description
technical field [0001] The invention relates to a full-page printed circuit board. Background technique [0002] At present, in the production process of printed circuit boards, the intermediate process is full-page production, that is, a full-page printed circuit board includes several circuit boards, and then each circuit board is separated by a V-CUT machine, so that , there are many processes, and there will be a lot of burrs on the edge of the division. Contents of the invention [0003] The purpose of the present invention is to provide a full-page printed circuit board that can be quickly and conveniently divided. [0004] The technical scheme adopted by the present invention is: a full-page printed circuit board, each circuit board is connected through a connection position, and the feature is that the connection position and the circuit board are connected through a stamp hole. [0005] By adopting the present invention, the purpose of easy board separation betw...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
Inventor 王小贵黄大平兰晓萍
Owner ZHEJIANG KAIHUA JIANKE ELECTRONICS TECH
Features
- Generate Ideas
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
Why Patsnap Eureka
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com