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Electromagnetic micro jet device

A micro-spray and electromagnetic technology, applied in electrostatic spray devices, spray devices and other directions, can solve the problems of inappropriate metal material micro-spray, the frequency should not be too high, not applicable, etc., to facilitate stability, simplify the mechanical structure, and stabilize the hydraulic supply. force effect

Active Publication Date: 2015-07-15
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN200610138558.1 discloses a pneumatic-driven micro-liquid injection system, which is mainly used in the occasion of micro-distribution of reagents. Since it is driven by air pressure, its frequency should not be too high, and the device is not suitable for micro-injection of metal materials.
Chinese patent CN201110332491.6 discloses a fluid pulse injection device. The system uses the pressure of the pressurized liquid to drive the micro-spray. It is suitable for pulse-type micro-spray irrigation systems. It belongs to a continuous micro-spray device and is not suitable for on-demand spraying occasions.
Chinese patent CN201110074206.5 discloses a pulse micro-spray irrigation system. The system uses a spring mechanism to cooperate with the pressure of the liquid itself to switch between positive and negative pressure and obtain continuous micro-spray of the liquid. It is suitable for continuous irrigation, but not suitable for on-demand spraying.

Method used

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Embodiment Construction

[0015] see Figure 1~3 , the embodiment of the present invention is provided with an upper magnet 1, an injection cavity (including an upper cover plate 2, a middle partition plate 3 with a nozzle and a lower cover plate 4), a lower magnet 5, an electrode 7, a liquid supply pipe 8, a lift Table 9, stepper motor 10, liquid supply tank 11 and pulse current device 12.

[0016] The upper cover plate 2, the middle partition plate 3 with nozzles and the lower cover plate 4 are installed together to form a spray chamber 6. One side of the middle partition plate 3 is provided with a liquid inlet 31, and the other side of the middle partition plate 3 is provided with a nozzle for liquid outlet. 32. The upper magnet 1 and the lower magnet 5 are placed on the upper and lower surfaces of the injection cavity, so that the injection cavity 6 is in the magnetic field B. The pulse current device 12 is used to generate pulse current, and its positive and negative poles are connected with the...

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Abstract

The invention discloses an electromagnetic micro jet device, and relates to a micro jet device. The electromagnetic micro jet device is suitable for jet of metal liquid as required, and is provided with an upper magnet, a jet cavity, a lower magnet, electrodes, a liquid feed pipe, a liquid feed tank, a lifting mechanism, a stepping motor and a pulse current device, wherein the upper magnet and the lower magnet are fixed on the upper surface and the lower surface of the jet cavity respectively; the jet cavity is provided with a liquid inlet and a liquid nozzle; the electrodes are arranged on the two sides of the jet cavity and stretch into the jet cavity; one end of the liquid feed pipe is communicated with an inner cavity of the jet cavity; the other end of the liquid feed pipe is communicated with the liquid feed tank; an input end of the lifting mechanism is connected with the stepping motor; an output end of the lifting mechanism is connected with the liquid feed tank; and the two ends of the pulse current device are connected with the electrodes.

Description

technical field [0001] The invention relates to a micro-spraying device, in particular to an electromagnetic micro-spraying device for liquid metal micro-spraying. Background technique [0002] With the development of microelectronic packaging technology, there are more and more processes that need to use fluid materials in the microelectronics industry, which promotes the rapid development of fluid micro-jet technology. Fluid microjet technology is a key technology in microelectronic packaging. It can be structured to form points, lines, surfaces (coating) and various graphics, and is widely used in chip fixing, package flipping and chip coating. This technology is the process of precisely dispensing fluids in a controlled manner to transfer ideally sized fluids (such as solder, conductive glue, epoxies, and adhesives, etc.) to workpieces (chips, electronic components, etc.) ) in the appropriate position to achieve mechanical or electrical connections between components. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B5/00
Inventor 孙道恒罗志伟王凌云柳娟郑高峰李益盼
Owner XIAMEN UNIV
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