A kind of manufacturing method of pcb board

Abstract

The invention discloses a manufacturing method for a printed circuit board (PCB) and the PCB. The method comprises the steps that a first window is formed in first core plates and first resin plates, wherein the first core plates and the first resin plates form a lamination, and the shape and the size of the first window are matched with the shape and the size of a heat dissipation copper block; a second window is formed in second core plates and second resin plates between the second core plates and the lamination, wherein a daughter plate is to be inserted into the second core plates, and resin blocks at the position of the second window of the second resin plates are enabled to be connected with one edge of the second window of the second resin plates, wherein the shape and the size of the second window are matched with the shape and the size of the daughter plate; sol dissolving is conducted on the lamination, the second core plates and the second resin plates; the resin blocks at the position of the second window of the second resin plate are turned over, and the heat dissipation copper block is embedded into the first window in the lamination through the second window; the resin blocks at the position of the second window of the second resin plate are dissolved into the second window of the second resin plates; and the daughter plate is embedded into the second window of the second core plates.

Description

technical field [0001] The invention relates to the field of printed circuit board processing, in particular to a method for manufacturing a PCB board and the PCB board. Background technique [0002] With the high-frequency development of electronic equipment, especially the development of wireless networks and satellite communication equipment, information products are moving towards high speed and high frequency, and communication products are moving towards large capacity and fast wireless transmission of voice, video and data standardization development trend is inevitable. The substrates required by the new generation of communication products also need to cooperate with its development, and obviously the traditional FR-4 materials cannot meet the existing needs. If high-frequency signals are to be used in the traditional PCB production process, the entire layer is designed to be made of high-frequency materials. If only partial (mostly less than 1 / 3 of the entire boar...

AI Technical Summary

Problems solved by technology

[0008] In order to solve the problems of large stacking workload, low stacking efficiency, slow production progress, and poor product quality caused by flipping the stacked boards during the stacking process of local mixed pressure and copper block blind buried boards, the present invention provides a PCB board Manufacturing method and PCB board

Images