Electrolysis copper plating solution

Abstract

The invention discloses an electrolysis copper plating solution. The electrolysis copper plating solution comprises, by weight, 30-50g / L of one kind of cupric nitrate, 100-150g / L of hydroxy butylidene phosphonic acid, 1-5g / L of phosphonic acid dimethyl ammonium, 5-10g / L of tripotassium citrate, 0.01-0.05g / L of polyethyleneimine and the rest of the electrolysis copper plating solution is water. The electrolysis copper plating solution is reasonable in formula, good in stability of plating solution, environment-friendly, pollution free, and good in quality of produced products.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to an electrolytic copper plating solution. Background technique [0002] Copper plating of metal parts can obtain better anti-corrosion effect and electrical conductivity. At present, the copper electroplating solution used in large quantities is seriously polluted, the wastewater treatment is difficult, the plating solution has poor stability, and the service life is short and needs to be replaced frequently. Contents of the invention [0003] The purpose of the present invention is to provide an electrolytic copper plating solution with reasonable formula, good stability, long service life and high coating quality. [0004] Technical solution of the present invention is: [0005] An electrolytic copper plating solution, which is characterized in that: that is, the formula is: 30-50g / L of copper nitrate, 100-150gL of hydroxybutylene diphosphonic acid, and 1-5...

AI Technical Summary

Problems solved by technology

[0002] Copper plating of metal parts can obtain better anti-corrosion effect and electrical conductivity. At present, the copper electroplating solution used in large quantities is seriously polluted, wastewater treatment is difficult, the stability of the plating solution is poor, and the service life is short and needs to be replaced frequently.