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Dual-curing adhesive composition and application thereof and method for bonding substrates

A technology of composition and adhesive, which is applied in the field of bonding substrates and dual-curing adhesive compositions, can solve the problems of adhesive 5 that cannot be cured, aging deformation hardness, substrate cracking, etc., and can improve the light curing rate Effect

Inactive Publication Date: 2013-05-08
HENKEL KGAA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical applications, some patterns 4 that cannot be transmitted by the light source 6 are often arranged between the first substrate 1 and the adhesive 2 according to needs, forming, for example, a black light-shielding area, thereby causing adhesion under the light-shielding area. Agent 5 cannot cure
In addition, due to improper control of factors such as light angle, intensity, and time in actual operation, it often happens that the adhesive is cured in the light-transmitting area but not in the light-shielding area, or the surface of the adhesive is completely cured but the interior is not fully cured. The phenomenon
Non-curing in light-shielded areas or insufficient curing of some adhesives will cause the above-mentioned problems such as adhesive overflow, substrate cracking, aging deformation, and insufficient hardness, which will lead to deterioration of the performance of the final product

Method used

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  • Dual-curing adhesive composition and application thereof and method for bonding substrates
  • Dual-curing adhesive composition and application thereof and method for bonding substrates
  • Dual-curing adhesive composition and application thereof and method for bonding substrates

Examples

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Effect test

preparation example Construction

[0143] [Preparation of dual-cure adhesive composition]

[0144] Epoxy resin, (meth)acrylate monomer and / or oligomer having (meth)acryloyloxy group, thermal polymerization catalyst, photopolymerization initiator and optionally other components used in the present invention Mixing can be done by any suitable method, in any suitable order. Mixing can be performed continuously or batchwise. Stirring may be performed during mixing as required. In different stages of mixing, the stirring speed can be set to be the same or different, for example, the preceding stirring speed can be set to about 50-80 rpm, and the subsequent stirring speed can be set to about 80-120 rpm.

[0145] Mixing and subsequent storage should be performed under reduced lighting conditions, preferably dark conditions, at the time of and after addition of the photopolymerization initiator. It is advantageous to complete the mixing with other components before mixing the photopolymerizable component with the ph...

Embodiment 1

[0182] First, at room temperature, weigh 35 parts by weight of Synasia S21, 3 parts by weight of isobornyl acrylate, 5 parts by weight of hydroxypropyl methacrylate, 5 parts by weight of dodecyl acrylate, 30 parts by weight of CN8004, 15 The parts by weight of CN9002 and 2 parts by weight of polyol220-110 are put into a stirring tank for stirring, the speed is set at about 60 rpm, and the stirring time is about 60 min. Subsequently, weigh 1.5 parts by weight of K1612, 1.5 parts by weight of Darocure 1173 and 2 parts by weight of Irgacure784, put them into the mixer, set the speed at about 100 rpm, and continue stirring for about 60 minutes. After mixing evenly, the obtained mixture can be filtered. During the entire feeding and stirring process, keep away from light and keep constant temperature.

[0183] The specific formulation of the dual curing adhesive composition of embodiment 1 is shown in the following table:

[0184]

Embodiment 2

[0186] The dual-cure adhesive composition of Example 2 was prepared in the same manner as in Example 1, except that the formulation of the dual-cure adhesive composition was changed as shown in the table below.

[0187] The specific formulation of the dual curing adhesive composition of embodiment 2 is shown in the table below:

[0188]

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Abstract

The invention provides a dual-curing adhesive composition which comprises the following components: component (a): epoxy resin; at least one selected from component (b) and component (c), wherein the component (b) is a (methyl) acrylate monomer, and the component (c) is oligomer with a (methyl) acrylyloxy group; component (d): a thermopolymerization catalyst used for catalyzing a thermopolymerization reaction of the component (a); and component (e): a photopolymerization initiator used for initiating an photopolymerization reaction of the component (a) and at least one material selected from the component (b) and the component (c), wherein the component (e) is a mixture of a cationic photopolymerization initiator and a free radical photopolymerization initiator. The dual-curing adhesive composition of the invention is used for bonding or lamination between light transmitting substrates, or between a light transmitting substrate and a lightproof substrate. The invention also provides a method for bonding substrates.

Description

technical field [0001] The present invention relates to a light-curable and heat-curable adhesive composition, also known as a "dual-cure adhesive composition", and to the use of said dual-cure adhesive composition and to bonding substrates Methods. Background technique [0002] Due to the active epoxy group contained in the epoxy resin molecule, under the action of the photopolymerization initiator, the epoxy group is prone to ring-opening addition to form a three-dimensional network polymer with an ether bond structure. Both the ether bond and the hydroxyl group derived from the epoxy group are highly polar, and they can react with the free radicals on the surface of the substrate to which they are attached to form chemical bonds, thus showing adhesive properties. [0003] Epoxy resins cured by light have the advantages of low curing temperature, fast curing speed, small shrinkage and environmental friendliness. Therefore, epoxy resins are being more and more widely used ...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J5/00C09J5/06
CPCC09J163/00C08F220/18C08F220/20C09J133/06B32B2037/1253B32B37/1284C08L75/16C08F220/1811C08F220/1812
Inventor 张瑞吕道强
Owner HENKEL KGAA
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