Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semi-automatic polishing machine

A kind of grinding machine, semi-automatic technology, applied in the direction of grinding machine, abrasive belt grinder, grinding/polishing equipment, etc., can solve the problems of manual operation difficult to control, the thickness of the metal conductive sheet becomes smaller, and affect the function of the metal conductive sheet, etc., to improve The effect of production efficiency and yield

Active Publication Date: 2013-04-10
NINGDE AMPEREX TECH
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to bond tin between two metal conductive sheets at a temperature below 360 degrees, the best way is to erase the protective coating at the junction of the two metal conductive sheets. At present, erasing the protective coating of the metal conductive sheet is mainly It is processed by hand, that is, the surface of the metal conductive sheet is wiped by sandpaper, but since the thickness of the metal conductive sheet with a protective coating is only 0.1mm, and the thickness of the protective coating is only 0.01mm, the thickness to be removed by sandpaper It is only 0.01mm, and manual operation is difficult to control. The number and strength of wiping will directly affect the removal effect. If the number and strength of wiping are not enough, the protective coating cannot be completely removed. / or too much force will not only remove the protective coating, but also make the thickness of the metal conductive sheet smaller, affecting the use of the metal conductive sheet

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semi-automatic polishing machine
  • Semi-automatic polishing machine
  • Semi-automatic polishing machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] See Figure 1 to Figure 4 , a semi-automatic grinding machine, including a bracket 1 and a table 2, and also includes a first workbench 3 for fixing a workpiece to be polished and a second workbench 4 for grinding on the table 2, above the first workbench 3 A compacting device 5 for compacting the workpiece to be polished is provided, and the second workbench 4 is provided with an upper grinding device 6 and a lower grinding device 7 which can move cyclically, and between the upper grinding device 6 and the lower grinding device 7 is provided Grinding the gap where the workpiece protrudes, the size of the gap can be adapted and adjusted according to the thickness of the workpiece to be polished and the grinding pressure.

[0045] The upper grinding device 6 includes a driving roller 61, a driven roller 62, an upper sandpaper 63 and a driving device 64. The upper sandpaper 63 is set as a belt type, and the upper sandpaper 63 is sleeved on the driving roller 61 and the dr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a semi-automatic polishing machine, which comprises a bracket, a table board, a first workbench arranged on the table board and used for fixing a workpiece to be polished, and a second workbench used for polishing, wherein a pressing device used for pressing the workpiece to be polished is arranged above the first workbench, the second workbench is provided with an upper polishing device and a lower polishing device which can be moved circularly, and a gap for the workpiece to be polished to extend in is formed between the upper polishing device and the lower polishing device. The polishing times and the polishing strength can be precisely controlled by the semi-automatic polishing machine, so that the polishing thickness of a metal conducting plate can be controlled, automatic control is adopted by the semi-automatic polishing machine, and the production efficiency and the yield can be improved.

Description

technical field [0001] The invention relates to the technical field of grinding equipment, in particular to a semi-automatic grinding machine. Background technique [0002] At present, in the field of battery production, in the internal components of the battery, two metal conductive sheets with an electrical connection relationship need to be connected by welding. Metal conductive sheets shipped from hardware processing factories generally have a protective coating on the surface, and most of the protective coating is nickel. When two metal conductive sheets are welded by soldering, due to the existence of the protective coating, when the welding temperature is below 360 degrees, it is difficult for tin to adhere to the junction of the two metal conductive sheets. In order to bond tin between two metal conductive sheets at a temperature below 360 degrees, the best way is to erase the protective coating at the junction of the two metal conductive sheets. At present, erasing...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B24B21/10B24B21/20
Inventor 朱伟
Owner NINGDE AMPEREX TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com