Phase-calibrated 3D-package surface antenna with embedded plated through holes

Abstract

The invention relates to a horn antenna, in particular to a phase-calibrated 3D-package surface antenna with embedded plated through holes. The antenna comprises a plated vertical through hole feeder (1), a horn antenna (2) and plated through holes (3), wherein the plated vertical through hole feeder (1), the horn antenna (2) and the plated through holes (3) are integrated on a dielectric substrate (4). The dielectric substrate (4) is arranged at the topmost of 3D package (5). One end of the plated vertical through hole feeder (1) is connected with an internal circuit (8). The horn antenna (2) comprises a bottom metal plane (6), a top metal plane (9) and plated through hole sidewalls (11). Through hole arrays (16) of the plated through holes (3) form a plurality of dielectric loaded waveguides (17) in the horn antenna (2). One port of each dielectric loaded waveguide (17) faces to a short surface (15) of a narrow-section waveguide (13), and the other port (18) of each dielectric loaded waveguide (17) extends towards an antenna aperture surface (12) without reaching the same. Gain of the phase-calibrated 3D-package surface antenna with embedded plated through holes can be increased.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a three-dimensional packaged surface antenna embedded with metallized via holes for phase calibration. Background technique [0002] Using micro-assembly technology, a radio frequency system can be integrated in a package, for which the antenna also needs to be integrated on the surface of the package. It is a natural way to integrate a patch antenna on the surface of the package, but the main radiation direction of the patch antenna is the normal direction of the surface, and the main radiation direction we sometimes need is along the surface direction. If the horn antenna is integrated on the surface of the package, the radiation along the surface direction can be realized. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substrate-integ...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration, but the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. The reason is that the horn The continuous opening of the mouth causes the phase out of synchronization when the electromagnetic wave propagates to the horn's aperture surface, the phase distribution of the electric field intensity of the aperture is uneven, and the radiation directivity and gain decrease

At present, methods such as dielectric loading and dielectric prisms have been used to correct the phase of the horn aperture field, but these phase calibration structures increase the overall structural size of the antenna and are not suitable for integration into the package surface

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