Peeling device and manufacturing method for electronic device
A peeling device and manufacturing method technology, which are applied in the fields of semiconductor/solid-state device manufacturing, chemical instruments and methods, electrical components, etc., can solve problems such as cracking of reinforcing plates, and achieve the effect of suppressing damage
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no. 1 Embodiment approach
[0050] In order to cope with the thinning of substrates used in electronic devices, the method of manufacturing an electronic device according to this embodiment includes a step of forming a functional layer on a substrate reinforced with a reinforcing plate, and separating the substrate on which the functional layer is formed and the reinforcing plate. The stripping process. Stiffeners do not form part of the electronics.
[0051] Here, the electronic device refers to electronic components such as a display panel, a solar cell, and a thin-film rechargeable battery. The display panel includes a liquid crystal panel (LCD), a plasma panel (PDP), and an organic EL panel (OLED).
[0052](Laminates)
[0053] figure 1 It is a side view of a laminated board used in the manufacturing process of an electronic device. The laminated board 1 includes a base plate 2 and a reinforcement plate 3 for reinforcing the base plate 2 .
[0054] (substrate)
[0055] During the manufacturing p...
no. 2 Embodiment approach
[0139] In the above-described first embodiment, the flexible plate 30 , the plurality of movable bodies 40 , the plurality of links 60 , the plurality of driving devices 70 , and the like are arranged on one side of the laminated body 6 .
[0140] On the other hand, in the present embodiment, flexible plates 30 , a plurality of movable bodies 40 , a plurality of links 60 , a plurality of driving devices 70 , and the like are arranged on both sides of the laminated body 6 .
[0141] Figure 8 It is a partial sectional view showing the peeling device of the second embodiment. Figure 9 yes means Figure 8 A partial cross-sectional view of an example of the operation of the peeling device. Figure 10 (a)~(f) means using Figure 8 An example of the peeling process of the peeling device.
[0142] The peeling apparatus 110 of this embodiment has the 1st flexible plate 30A arrange|positioned at one side of the laminated body 6, the some 1st movable body 40A, the some 1st link 60A...
no. 3 Embodiment approach
[0158] In this embodiment, although it is used in the same manner as in the second embodiment Figure 8 The peeling device shown performs the peeling, but the behavior of the peeling device is different.
[0159] Figure 11 (a)~(f) means using Figure 8 The figure of other peeling process of the peeling device.
[0160]The laminated body 6 is placed on the second flexible board 30B with the reinforcement board 3A on the upper side. The control device 80 lowers the first frame body 16A to a predetermined position, and presses the first flexible board 30A against the reinforcement board 3A. Next, the control device 80 vacuum-adsorbs the reinforcing plate 3A using the first flexible plate 30A. In this state, if Figure 11 (a) and Figure 8 As shown, the first and second flexible plates 30A, 30B are in flat plate shape.
[0161] Next, if Figure 11 As shown in (b) and (c), the control device 80 bends and deforms the first flexible plate 30A so as to peel off the interface ...
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Abstract
Description
Claims
Application Information
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