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Dual-sided processing method and exposure device

A technology of exposure device and double-sided process, which is applied in photoplate-making process exposure device, micro-lithography exposure equipment, pattern-surface photoplate-making process, etc., can solve the problems of difficult alignment and low product yield, and achieve Improve efficiency, position accuracy, and ensure quality

Inactive Publication Date: 2013-03-13
BOE TECH GRP CO LTD
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Problems solved by technology

Although this method can achieve accurate alignment, it is more difficult to align and the yield of products is lower

Method used

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  • Dual-sided processing method and exposure device
  • Dual-sided processing method and exposure device
  • Dual-sided processing method and exposure device

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Embodiment Construction

[0032] The specific implementation manner of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0033] In the existing double-sided process, it is difficult to identify the substrate alignment mark, and the yield rate of the finished product is low. Therefore, in order to solve this problem, the present invention designs the exposure device for the double-sided process. Alignment processing, and then the double-sided graphics of the substrate are made separately.

[0034] This embodiment provides a double-sided process method and exposure device in the manufacturing process of semiconductors and liquid crystal displays. During the exposure operation, such as figure 1 and figure 2 As shown, the double-sided process method comprises the following steps:

[0035] S1: according to actual needs, perform alignment processing on the two photomasks 1 used in the double-sided manufacturing process.

[0036] The alignment process...

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Abstract

The invention relates to the field of semiconductors and liquid crystal displays, in particular to a dual-sided processing method and an exposure device in a processing process of a semiconductor and a liquid crystal display. The dual-sided processing method comprises the steps of: in an exposure process, firstly, aligning two optical masks in an exposure device, then conveying a substrate to a place between the two optical masks of the exposure device, and finally making patterns on two sides of the substrate. The exposure device comprises two optical masks, wherein the substrate to be processed is arranged between the two optical masks, and an optical mask alignment identifier is arranged on each of the two optical masks. According to the invention, during the dual-sided processing process of patterns of the substrate, the optical masks are aligned in advance, the accuracy of the patterns on two sides of the substrate is ensured, and the product quality is ensured.

Description

technical field [0001] The invention relates to the field of semiconductors and liquid crystal displays, in particular to a double-sided process method and an exposure device in the manufacturing process of semiconductors and liquid crystal displays. Background technique [0002] In today's products, more and more double-sided process technology will be used. Such as touch screen Touch, grating and other fields. With the development of science and technology, the requirements for product quality are getting higher and higher, especially in terms of precision control. [0003] In the existing double-sided process technology, for Touch products that do not require high precision, the double-sided processing method without alignment is often adopted. Although such a process is simple, the precision is too low, and the display at the back end will be affected. For grating products that require high precision, the graphics on one side will be made first, and then the graphics ...

Claims

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Application Information

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IPC IPC(8): G03F7/20G03F9/00G03F1/42
CPCG03F7/20G03F7/70425G03F9/7003G03F9/7084G03F7/70725
Inventor 王灿何璇
Owner BOE TECH GRP CO LTD
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