Polyamide-imide resin insulating varnish and method of manufacturing the same, insulated wire and coil

A technology of polyamide-imide resin and insulating coating, which is applied in the direction of plastic/resin/wax insulator, insulated cable, transformer/inductor coil/winding/connection, etc., and can solve the problems of easy partial discharge and high dielectric constant , to achieve excellent partial discharge characteristics, excellent coating operability and cost-effective effects

Inactive Publication Date: 2013-02-06
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] On the other hand, as one of the disadvantages of polyamide-imide resin, it is easy to generate partial discharge when it is used as a material for the insulating film of an insulated wire because of its high dielectric constant.

Method used

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  • Polyamide-imide resin insulating varnish and method of manufacturing the same, insulated wire and coil
  • Polyamide-imide resin insulating varnish and method of manufacturing the same, insulated wire and coil
  • Polyamide-imide resin insulating varnish and method of manufacturing the same, insulated wire and coil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0074] In the first stage of synthesis, 192 g (1.0 mol) of trimellitic anhydride as the tricarboxylic anhydride (A) of the embodiment, and 175.2 g of 4,4'-diphenylmethane diisocyanate as the diisocyanate component (B) of the embodiment (0.7 mol) and 600 g of N-methyl-2-pyrrolidone as a solvent were put into a flask, stirred at 80° C. for 2 hours, and then stirred at 100° C. for 1 hour. A flask equipped with a stirrer, a nitrogen inflow tube, and a thermometer was used for the flask. Then, the reaction solution was cooled to room temperature while maintaining the nitrogen atmosphere.

[0075] As the synthesis of the second stage, 100 g (0.5 mol) of 4,4'-diaminodiphenyl ether as the diamine component (C) of the embodiment is put into the reaction liquid, and N-methyl-2-pyrrolidone 801.6 g, stirring overnight at room temperature to obtain a polyamide-imide resin insulating coating containing an amic acid-containing compound.

Embodiment 2）

[0077] In the first stage of synthesis, 192 g (1.0 mol) of trimellitic anhydride as the tricarboxylic anhydride (A) of the embodiment, and 175.2 g of 4,4'-diphenylmethane diisocyanate as the diisocyanate component (B) of the embodiment (0.7 mol) and 600 g of N-methyl-2-pyrrolidone as a solvent were put into a flask, stirred at 80° C. for 2 hours, and then stirred at 100° C. for 1 hour. Then, the reaction solution was cooled to room temperature while maintaining the nitrogen atmosphere.

[0078] As the synthesis of the second stage, 205.1 g (0.5 moles) of 2,2-bis(4-aminophenoxyphenyl)propane, which is the diamine component (C) of the embodiment, is put into the reaction liquid, and N-methyl 1116.9 g of base-2-pyrrolidone was stirred overnight at room temperature to obtain a polyamide-imide resin insulating coating material containing an amic acid-containing compound.

Embodiment 3）

[0080]In the first stage of synthesis, 192 g (1.0 mol) of trimellitic anhydride as the tricarboxylic anhydride (A) of the embodiment, and 175.2 g of 4,4'-diphenylmethane diisocyanate as the diisocyanate component (B) of the embodiment (0.7 mol) and 600 g of N-methyl-2-pyrrolidone as a solvent were put into a flask, stirred at 80° C. for 2 hours, and then stirred at 100° C. for 1 hour. Then, the reaction solution was cooled to room temperature while maintaining the nitrogen atmosphere.

[0081] In the second stage of synthesis, 156 g (0.5 mol) of 4,4'-oxydiphthalic dianhydride as the tetracarboxylic dianhydride (D) of the embodiment, and the diamine component (C) of the embodiment were prepared. 410g (1.0 mol) of 2,2-bis(4-aminophenoxyphenyl)propane was put into the reaction solution, 2199.6g of N-methyl-2-pyrrolidone was added, and stirred overnight at room temperature to obtain The compound of polyamide-imide resin insulating coating.

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Abstract

Provided are a polyamide-imide resin insulating varnish that is capable of forming an insulation covering that is excellent in partial discharge resistance, and is excellent in coating workability and cost performance, a method of manufacturing the insulating varnish, an insulated wire formed by using the insulating varnish and a coil formed by using the insulated wire.A polyamide-imide resin insulating varnish includes an amic acid-containing amide compound including a repeating unit represented by a general formula (1): where X is a divalent organic group, and R1 is a divalent organic group derived from a diamine.

Description

technical field [0001] The present invention relates to a polyamide-imide resin insulating paint, a manufacturing method thereof, an insulated wire, and a coil. Background technique [0002] Conventionally, an insulated electric wire having an insulating film formed using a polyamide-imide resin insulating varnish is known (for example, refer to Patent Document 1). Polyamide-imide resin insulation paint is a heat-resistant polymer resin that contains amide groups and imide groups in a roughly 50 / 50 ratio and is excellent in heat resistance, mechanical properties, hydrolysis resistance, and the like. [0003] Polyamide-imide resin insulating coatings are usually made by using N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAC), two It is produced by the decarboxylation reaction of 4,4'-diphenylmethane diisocyanate (MDI) and the main two components of trimellitic anhydride (TMA) in a polar solvent such as methyl imidazolinone (DMI). [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D179/08C09D5/25C08G73/14H01B7/02H01F5/00H01F27/28
CPCC09D179/08H01B3/305H01B7/02H01F5/06C08G73/14H01F5/00H01F27/28H01B3/306H01B3/30
Inventor 牛渡刚真本田佑树锅岛秀太菊池英行
Owner HITACHI METALS LTD
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