Lamp panel technology of LED (Light Emitting Diode) lamp

A technology for LED lamps and light boards, which is applied in electrical components, electric solid state devices, circuits, etc., can solve problems such as the increase in the volume of light boards and the problems of quality control in the production process.

Inactive Publication Date: 2013-01-30
XIAN XINWEI INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This brings about quality control problems in the production process
On the other hand, the size of the lamp panel increases

Method used

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  • Lamp panel technology of LED (Light Emitting Diode) lamp
  • Lamp panel technology of LED (Light Emitting Diode) lamp
  • Lamp panel technology of LED (Light Emitting Diode) lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] Such as figure 1 As shown, a lamp panel and process of an LED lamp, including: insulating material and metal wires, the metal wires are evenly distributed in a circular body or a square body formed by the insulating material and formed.

[0017] Such as figure 2 and image 3 As shown, the circular body or square body is cut into an insulating substrate 1, and the metal wires in the insulating substrate 1 are segmented to form a heat dissipation conductor 2. The center of the heat dissipation conductor 2 is stamped to form an LED lamp cup 3, and an electrode of the wafer 4 is passed through a conductive glue. Fixed in the lamp cup 3, the other electrode of the wafer 4 is connected to the second wafer through the bonding wire 5, and the surface of the lamp board on which the LED wafer is placed is sealed with a transparent resin or blue-white light process.

[0018] The metal wires are distributed at intervals of the insulating material, and the interval is between 0.1...

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PUM

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Abstract

The invention relates to an LED (Light Emitting Diode) lamp, in particular to a lamp panel technology of the LED lamp. The lamp panel technology of the LED lamp is characterized by comprising an insulating material and metal conducting wires; the metal conducting wires are uniformly distributed in a circular body or a quadrate body formed by the insulating materials; the circular body or the quadrate body can be cut to form an insulating base plate; the metal conducting wires in the insulating base plate are sectioned to form radiating conductors; the centers of the radiating conductors are punched to form an LED lamp cup; one electrode of a wafer is fixed into the lamp cup through a conductive adhesive; another electrode of the wafer is connected with a second wafer through a binding wire; and a lamp panel is provided with an LED wafer surface for being processed by light transmitting resin or blue white light technology in a sealing way. The invention provides a lamp panel technology of the LED lamp, which is small in size of the lamp panel and high in technology performance.

Description

technical field [0001] The invention relates to an LED lamp, in particular to a lamp board process of the LED lamp. Background technique [0002] The lifespan and brightness stability of LED lamps are affected, on the one hand, it is related to the manufacturing process, on the other hand, it is related to the temperature and whether the current is constant. The former belongs to the production link, while the latter belongs to the use link. The use of poor craftsmanship and technology will seriously affect life and brightness. [0003] High-power LED lights pass a current of more than 300ma on a very small chip, such as a working voltage of 3.3v, and its power is 1w, so a good radiator is needed to dissipate heat from the die. Otherwise, the life of the LED lamp will be affected. [0004] The working current of the low-power LED is 20ma, so it can dissipate heat well by its own bracket, but to achieve the high power used, many low-power LEDs need to be connected in serie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/13H01L33/48H01L33/60H01L33/56
CPCH01L2224/48091H01L2224/48247
Inventor 刘珉恺
Owner XIAN XINWEI INFORMATION TECH
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