Method for manufacturing light emitting diode packaging structure

Abstract

The invention discloses a method for manufacturing a light emitting diode packaging structure. The method comprises the following steps of: supplying a substrate; paving a sticky layer on the substrate; forming a plurality of pairs of metal layers on the sticky layer; forming a reflection layer on the sticky layer, wherein the reflection layer is provided with a plurality of grooves surrounding the metal layers, and the bonding force of the sticky layer to the substrate is greater than that of the sticky layer to the reflection layer; arranging light emitting diode chips in the grooves respectively, and electrically connecting the light emitting diode chips and corresponding metal layers in the grooves; forming packaging layers in the grooves, and covering the light emitting diode chips in the packaging layers; and separating the substrate together with the sticky layer from the reflection layer and the metal layers which are positioned on the sticky layer. Therefore, the substrate-free light emitting diode packaging structure is formed; the thickness of the light emitting diode packaging structure is reduced; and a thinned structure is realized.

Description

technical field [0001] The invention relates to a semiconductor manufacturing method, in particular to a manufacturing method of a light emitting diode packaging structure. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] Existing LED packaging structures generally use a substrate as a packaging substrate, on which electrodes are formed, and LED chips are mounted on the substrate and electrically connected to the electrodes. However, today's light-emitting diode elements tend to be more and more light and thin in appearance, and the overall thickness of the light-emitting diode package structure of this structure is limited by the thickness of the ...

AI Technical Summary

Problems solved by technology

However, today's light-emitting diode elements tend to be more and more light and thin in appearance, and the overall thickness of the light-emitting diode package structure of this structure is limited by the thickness of the substrate and cannot be thinner; in addition, due to the heat generated by the light-emitting diode It is transmitted to the substrate through the electrodes and then radiated outwards. There is usually a large thermal resistance between the electrodes and the substrate, which is not conducive to the heat dissipation of high-power LED lamps.

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