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Module type high-speed mounting head for chip mounter

A placement head and modular technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of increased cost of placement machines, bloated placement heads, and difficulty in controlling accuracy, and achieves easy maintenance and maintenance. Replaceable, responsive effects

Active Publication Date: 2013-01-09
JIANGSU NANJIXING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These mechanisms either have low precision and are difficult to control the precision; or the structure is complex and difficult to assemble, making the placement head bulky and heavy; or the precision is high, but the price is expensive, which increases the cost of the placement machine

Method used

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  • Module type high-speed mounting head for chip mounter
  • Module type high-speed mounting head for chip mounter
  • Module type high-speed mounting head for chip mounter

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Embodiment Construction

[0035] Such as figure 1 , figure 2 with image 3 As shown, the modular high-speed placement head for a placement machine of the present invention includes a placement head fixing frame 5, a pulley frame 4, a placement spindle 8, a lifting mechanism and a rotating mechanism. The placement head holder 5 is an L-shaped structure, and the two sides of the top of the L-type placement head holder 5 are respectively provided with a boss and a groove, wherein the groove and the boss are equal in width and positions correspond to each other, which can They are snapped together, which facilitates the positioning of multiple placement heads when they are mounted side by side. The pulley frame 4 is a J-shaped structure, and the pulley frame is connected to the side of the L-shaped mounting head fixing frame 5 through two hexagon socket bolts.

[0036] The lifting mechanism includes a servo linear motor 9, a linear motor push rod 11 and a pressure block 6. The above-mentioned servo lin...

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PUM

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Abstract

The invention discloses a module type high-speed sticking head for a chip mounter and relates to the field of chip mounters of electronic surface mount, aiming at providing a module type high-speed sticking head which is simple in overall structure, small in size, light in weight, high in mounting efficiency, good in precision, flexible to integrate, easy to control and convenient to maintain. The module type high-speed sticking head comprises a mounting head fixing bracket, a belt wheel bracket, a mounting main shaft, an elevating mechanism and a rotating mechanism, wherein the belt wheel bracket, the mounting main shaft, the elevating mechanism and the rotating mechanism are connected with the mounting head fixing bracket; the elevating mechanism comprises a servo linear motor, a linear motor push rod and a pressing block, wherein the servo linear motor is installed on the mounting head fixing bracket; the pressing block is connected with the linear motor push rod; and the rotating mechanism comprises a stepper motor, a small belt wheel, an O-shaped belt and a belt wheel shaft, wherein the stepper motor is installed on the belt wheel bracket; and the belt wheel shaft is elastically connected with the mounting main shaft longitudinally.

Description

technical field [0001] The invention relates to the field of placement machines for electronic surface mounting, in particular to a modular high-speed placement head for placement machines. [0002] Background technique [0003] SMT is the abbreviation of Surface Mounted Technology, which is the most popular technology and process in the electronic assembly industry. As the main component and main technology of electrical interconnection technology, after more than 20 years of development, SMT has become the main technical means of PCB circuit component level interconnection of modern electronic products, and is the mainstream of modern electrical interconnection technology. Relevant data show that the penetration rate of SMT applications in developed countries has exceeded 75%, and it has further developed into the field of assembly technology represented by high-density assembly, three-dimensional assembly and other technologies. The continuous development of assembly t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
Inventor 胡毓晓姜涛张勇杰骆敏舟叶晓东毕世书孔令成赵贤相李露缪琴
Owner JIANGSU NANJIXING TECH
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