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Soldering flux matched with lead-free solder

A lead-free solder and flux technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of high melting point, poor wettability, and difficult cleaning, and meet environmental protection requirements. Safe and good wettability

Inactive Publication Date: 2012-12-19
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented solution offers various benefits over existing solutions like rosin or tin plasma coatings that have been used on electronic devices due to their ability to prevent corrosion caused by moisture ingress without leaving any residue behind when they were removed from circuit boards. These technical features include complete coverage with minimal amounts of grease while maintaining excellent wetting properties, safety concerns associated with certain chemical substances, and being environmentally friendly compared to other alternatives.

Problems solved by technology

This patented technical solution described in this patents relates to developing nonmetal (noble metal) solderings without harmful effects or drawbacks like inferior performance due to lower heat transfer property during reflow processes. To address these issues, current solutions involve adding various chemical substances called fluxes, but none offer complete replacement of existing ones.

Method used

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  • Soldering flux matched with lead-free solder
  • Soldering flux matched with lead-free solder
  • Soldering flux matched with lead-free solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Weigh 2.79g succinic acid, 0.86g adipic acid, 0.23g triethanolamine, 0.71gop-10, 0.36g CAB, 0.23g acrylic resin, 0.05g benzotriazole and completely dissolve in 10.52g ethylene glycol, 84.25 g ethanol compound solvent.

Embodiment 2

[0034] Weigh 2.79g succinic acid, 0.86g itaconic acid, 0.23g triethanolamine, 0.71gop-10, 0.40g CAB, 0.23g acrylic resin, 0.05g benzotriazole and completely dissolve in 11.84g diethylene glycol, 82.89 g ethanol compound solvent.

Embodiment 3

[0036] Weigh 5.39g of succinic acid, 1.67g of adipic acid, 0.23g of triethanolamine, 0.91gop-10, 0.11g of op-4, 0.23g of acrylic resin, and 0.06g of benzotriazole and dissolve them completely in 91.40g of ethanol solvent.

[0037] Table 1 is the weight percent of the main components of the flux in Examples 1-3.

[0038]

[0039] Table 2 shows the performance evaluation results of the fluxes in Examples 1-3 according to the performance testing standard of "No-Clean Liquid Flux SJ / T 11273-2002".

[0040]

[0041]

[0042] From the performance evaluation results in Table 2, it can be seen that the fluxes in Examples 1-3 all have the advantages of good physical stability, low residual solid content, no halogen, and low corrosion. type flux requirements.

[0043]Adopt the flux described in embodiment 1 and SnAgCu brazing filler metal, implement wave soldering welding process on the PCB board that is inserted with the electronic components and parts with lead wire, the app...

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Abstract

The invention discloses a soldering flux matched with a lead-free solder. The soldering flux comprises the following component in percentage by weight: 1.0-8.0 percent of organic active agent, 0.5-2.0 percent of surfactant, 0.1-2 percent of film forming agent, 0.01-0.1 percent of corrosion inhibitor and the balance of alcoholic solvent. The soldering flux has the following advantages that 1, a welding spot is plump and does not need to be washed after soldering; 2, wettability is good, and the defects such as lcicles and bridging do not occur; and 3, halogen is not contained, pollution is avoided, environmental requirements are satisfied, splashing and fiery and harmful gas are not produced in the welding process, and use is safe; and the soldering flux is particularly suitable for lead-free wave soldering and lead-free dipping soldering in a surface mount technology (SMT).

Description

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Claims

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Application Information

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Owner BEIJING UNIV OF TECH
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