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Radiating device for high-power relay

A technology of high-power relays and heat sinks, which is applied in the directions of relay ventilation/cooling/heating, etc., which can solve the problems of bulky products and increased costs

Inactive Publication Date: 2012-10-24
CHANGZHOU HUAXIAN HARDWARE FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the traditional radiators use metal as the heat conduction carrier, such as aluminum radiators, copper, and iron radiators. The heat dissipation rate of this radiator depends on the thermal conductivity of the metal material. Large radiator volume to achieve, resulting in bulky products, cost increases

Method used

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  • Radiating device for high-power relay

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Embodiment Construction

[0010] refer to figure 1 , the heat dissipation device of the high-power relay of the present invention, the box body 1 is provided with a heat conduction mount 2, the back of the heat conduction mount is provided with a disc-shaped pipeline 3, the disc-shaped pipeline 3 is connected to a cooling pump 4, and the cooling pump 4 is connected to a The liquid storage tank 5 that stores the cooling liquid is connected, and a temperature sensor 6 for detecting the temperature on the heat conduction mounting seat is arranged in the box body, and the temperature sensor 6 is connected with a controller 7, and the temperature sensor 6 transmits the detected temperature signal to the controller 7. The controller 7 is a 51 series single-chip microcomputer. The output end of the controller 7 is connected to the driver 8, and the driver 8 is connected to the cooling pump 4. A temperature value is preset in the controller. When the temperature in the box is higher than the preset temperature...

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Abstract

The invention discloses a radiating device for a high-power relay. A box body is internally provided with a heat conduction mounting seat; the back of the heat conduction mounting seat is provided with a disc-shaped pipeline which is connected with a cooling pump; the cooling pump is connected with a liquid storage tank used for storing cooling liquid; the box body is internally provided with a temperature sensor which is connected with a controller; an output end of the controller is connected with a driver; and the driver is connected with the cooling pump. The cooling device has the characteristics of being small in volume, light in weight and good in cooling effect.

Description

technical field [0001] The invention relates to the technical field of relays, in particular to a heat dissipation device for high-power relays. Background technique [0002] Most of the traditional radiators use metal as the heat conduction carrier, such as aluminum radiators, copper, and iron radiators. The heat dissipation rate of this radiator depends on the thermal conductivity of the metal material. In order to improve the heat dissipation requirements, the only way to increase the heat dissipation area is to increase the heat dissipation. Large radiator volume to achieve, resulting in bulky products, cost increases. Contents of the invention [0003] In view of the above technical problems, the object of the present invention is to provide a heat dissipation device for a high-power relay with small size, light weight and good heat dissipation effect. [0004] The technical scheme for realizing the above-mentioned purpose is as follows: [0005] For the heat dissip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H45/12
Inventor 郑延山
Owner CHANGZHOU HUAXIAN HARDWARE FACTORY
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