Method for producing sensor unit
A manufacturing method and sensor technology, which are used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of increased process difficulty, easy falling off or displacement, and overflow of glue, and achieve cost savings and excellent reliability. The effect of high degree and simple process
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[0035] see Figure 1 to Figure 3 , and with Figure 4 The present invention provides a method for manufacturing the sensor unit 1. The manufacturing method utilizes a one-time modeling method and an assembly spacer 13 to package and isolate the sensor unit 1, which has the effect of reducing the process cost, and more The defect of the traditional assembly method can be solved, and its manufacturing method includes the following steps:
[0036] Step (1): A substrate S is provided, and the substrate S includes a plurality of sensor regions 10 . Such as figure 1 As shown, in this specific embodiment, the substrate S includes an array of 6 by 6 sensor regions 10, and each sensor region 10 will form a sensor unit 1 ( Such as Figure 4 , Figure 5 shown). Each sensor area 10 is provided with two independent circuit areas 101, 102 on the surface and inside of the substrate S (but the number of the circuit areas 101, 102 can be more than two), and in this embodiment, the sensor...
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