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Fiber, fiber aggregate and adhesive having the same

A technology of aggregates and fibers, applied in the direction of ester copolymer adhesives, nitrile copolymer adhesives, vinyl aromatic copolymer adhesives, etc., can solve the problems of high manufacturing cost and inability to act

Inactive Publication Date: 2012-09-19
OPTOPAC +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the method cannot be used as a basic measure for preventing short-circuiting of fine-pitch electrodes and for obtaining stable and selective electrical connections, and requires high manufacturing costs
Therefore, related art methods still have limitations in connecting fine-pitch electronic components using anisotropic conductive films

Method used

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  • Fiber, fiber aggregate and adhesive having the same
  • Fiber, fiber aggregate and adhesive having the same
  • Fiber, fiber aggregate and adhesive having the same

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Embodiment Construction

[0082] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. This invention may, however, be embodied in different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numbers refer to like elements throughout.

[0083] figure 2 is a cross-sectional view illustrating a fiber according to the invention, image 3 is a cross-sectional view of a fiber illustrating an exemplary modification according to the invention, Figure 4 is a diagram illustrating irregular arrangement of fibers according to the present invention, and Figure 5 is a diagram illustrating regular arrangement of fibers according to the present invention.

[0084] Such as figure 2 As illustrated in , the fiber 110 according to the ...

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Abstract

Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Description

technical field [0001] The present invention relates to a fiber, a fiber aggregate, and an adhesive having the same, and more particularly, to a functional fiber and a fiber aggregate for realizing various functions, a Adhesive for easily bonding electronic components, and a method for manufacturing the same. Background technique [0002] Anisotropic conductive adhesive is an adhesive for both electrical connection between electrodes through conductive particles and mechanical connection based on a thermosetting resin and conductive particles dispersed in the thermosetting resin through thermosetting properties of the thermosetting resin . [0003] The method of connecting electronic components using anisotropic conductive adhesive is a lead-free alternative to conventional soldering methods. According to the method, this method is simple, environmentally friendly and more thermally stable, since high temperature does not have to be applied to the product all the time (low...

Claims

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Application Information

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IPC IPC(8): D01F1/09D01F1/10D02G3/38
CPCC09J133/08D01D5/0007C09J133/24C08L81/02C08L79/04H05K2201/0278C08L71/02H01R4/04C09J133/20C08L71/00C09J143/04H05K3/323H05K2201/029C09J177/10H01R12/52D01F1/10C08L77/10C09J177/06C08L81/06C09J135/06C08L77/00C08G2650/40Y10T428/254Y10T428/28Y10T428/2852Y10T428/287Y10T428/2874Y10T428/2878Y10T428/2887Y10T428/2891Y10T428/2896Y10T442/30C08K7/16D01D5/00H01B1/22
Inventor 金德勋白京煜石敬林金在玉
Owner OPTOPAC
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