Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof

A technology of epoxy conductive adhesive and LED chip, applied in epoxy resin adhesive, conductive adhesive, adhesive and other directions, can solve the problems of large waste, unsatisfactory performance of domestic products, poor electrical conductivity, etc., and achieve high thermal conductivity, Small sticky crystal residence time, good heat resistance and aging resistance

Active Publication Date: 2014-06-11
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since a large number of bubbles generated during the stirring process cannot be eliminated, it is easy to cause poor electrical conductivity and form defective products
The unused conductive adhesive will cure by itself, which is a huge waste, and the performance of domestic products cannot meet the requirements of the current application status

Method used

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  • Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof
  • Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (a) 11% of organic vehicle (7% of bisphenol A epoxy resin and 4% of modified bisphenol F epoxy resin); 3% of epoxy diluent C12-C14 alkyl glycidyl ether, in parts by mass Add in sequence, stir evenly, vacuumize and defoam for 15-20 minutes;

[0030] (b) Then add latent curing agent (micronized dicyandiamide Dyhard 100S: 0.9%, curing accelerator micronized feuron Dyhard UR 300: 0.6%), epoxy resin toughener Dow DER 736: 3%, additives (polymer dispersant Suosperse3263: 0.5%, antioxidant 1076: 0.5% and coupling agent KH-550: 0.5%) 1.5%, after mixing uniformly in the reactor, vacuumize 30-60min, the vacuum degree is -0.1MPa;

[0031] (c) Add 80% silver powder (flaky silver powder, 3-7μm 60% and spherical silver powder 0.1-0.5μm 20%) into the three-dimensional stirring tank, stir well and put it into a three-roller machine to grind 1-3 times to get the product Taste.

Embodiment 2

[0033] (a) 14% of organic vehicle (9% of bisphenol A epoxy resin and 5% of liquid novolac epoxy resin); 4% of epoxy diluent (2% of hexanediol glycidyl ether and 2% of resorcinol glycidyl Ether 2%); add in parts by mass, stir evenly, vacuumize and defoam for 15-20 minutes;

[0034] (b) Then add a latent curing agent (hexafluoroantimonate type heat-initiated cationic epoxy resin latent curing agent ICAM-8409: 1.3%, curing accelerator 2-ethyl 4-methylimidazole) in parts by mass 2E4MI: 0.7%), epoxy resin toughening agent, polyurethane modified epoxy resin PLM-3515 produced by Zhuzhou Shilin: 3%, additives 2% (0.5% coupling agent kh-560: 0.5% special silicone degassing Agent Nofol: 4559, antioxidant BHT: 0.5% and 0.5% polyurethane dispersant Suosperse 3263), after mixing evenly in the reactor, vacuumize for 30-60min, and the vacuum degree is -0.1MPa;

[0035] (c) Add flake silver powder 3-7μm 75% into a three-dimensional stirring tank, stir well and put it into a three-roll machin...

Embodiment 3

[0037] (a) 15% organic vehicle (composed of 10% bisphenol A epoxy resin and 6% modified bisphenol A / F epoxy resin), 5% epoxy diluent (trimethylolpropane triglycidyl ether 3 % and diglycidyl ether 2%), add in parts by mass, stir evenly, vacuumize and defoam for 15-20 minutes;

[0038] (b) Then add latent curing agent (micronized dicyandiamide Dyhard 100S: 1.5%, curing accelerator (micronized Feuron Dyhard UR: 300) 1.0%, epoxy resin toughening agent Tao by mass parts respectively DER 732: 3%, additives (polymer dispersant Suosperse3263: 0.5%, antioxidant-618: 0.5% and coupling agent KH-550: 0.5%) 1.5%, after mixing uniformly in the reactor, Vacuumize for 30-60min, the vacuum degree is -0.1MPa;

[0039] (c) Add 70% of silver powder (flaky silver powder 3-7μm 55% and spherical silver powder 0.1-0.5μm 15%) into the three-dimensional stirred tank, add 3% mixed acid methyl ester (MBE) solvent during the stirring process, and stir well Put it into a three-roll machine and grind it f...

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Abstract

The invention discloses epoxy conductive resin applicable to binding of LED (light-emitting diode) chips. A preparation method comprises the steps of: adding 8-18% of an organic carrier and 2-5% of epoxy diluent, evenly stirring, conducting vacuum defoamation for 15-20 minutes, adding and evenly mixing 0.6%-1.8% of a latent curing agent, 0.4-1.2% of a curing accelerator, 1-3% of epoxy resin flexibilizer, and 1-3% of an additive into a reaction kettle, conducting vacuumizing for 30-60 minutes with the vacuum degree of minus 0.1MPa; and finally adding 65-85% of silver powder into a three-dimensional stirred tank, and fully stirring evenly and grinding in a three-roll machine for one to three times, thus obtaining the epoxy conductive resin. The epoxy conductive resin has low resistivity, strong impact resistance, high heat conducting coefficient, strong mechanical strength, and good heat-resistant and aging-resistant performances, and can meet the active technology demand of LED packaging industry.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an epoxy conductive adhesive suitable for bonding LED chips and a preparation method thereof. Background technique [0002] LED (Lighting Emitting Diede) is a light-emitting diode, which is a semiconductor solid-state light-emitting device. Under the current upsurge of low-carbon economy, LED has developed rapidly as a revolutionary new light source, and the development of LED industry will also drive the development of related industries. Among them, it also drives the development of the conductive silver glue industry used in the LED manufacturing process for solid crystal to play the role of conductive connection. [0003] The traditional connection material is lead-tin solder, in which the lead content is about 40%. Lead is a toxic substance, which not only endangers human health but also pollutes the environment; at the same time, Pb / Sn solder can only be used in connections wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J9/02
Inventor 侯甫文冯朝波陈建军黄恒超
Owner GUANGZHOU BAIYUN CHEM IND
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