Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip

Abstract

The invention relates to a eutectic welding machine for die bonding of an LED (Light Emitting Diode) chip. The eutectic welding machine comprises a eutectic tray on which a step motor feeding mechanism capable of driving the eutectic tray to move horizontally is arranged, a target heating plate which is arranged below the eutectic tray and on which a heating plate drive cylinder used for driving the target heating plate to cling to the bottom of the eutectic tray is arranged, a sealing flat plate which is arranged above the eutectic tray, is connected with a sealing flat plate cylinder and is tightly combined with the upper end of the eutectic tray under the driving effect of the sealing flat plate cylinder to form a sealed cavity body, a chip compacting heat-conducting plate which is arranged in the sealed cavity body and is provided with a temperature sensor, a resonance energy conversion assembly which is connected with the chip compacting heat-conducting plate and is provided with a resonance cylinder, and an air pipeline assembly communicated with the inner part and the outer part of the sealed cavity body. Compared with the prior art, the eutectic welding machine for the die bonding of the LED chip has the advantages of good eutectic welding interface wettability, stable welding quality, small heating temperature balance error and the like.

Description

technical field [0001] The invention relates to a eutectic welding machine, in particular to a eutectic welding machine used for solid crystal of LED chips. Background technique [0002] At present, the eutectic welding machines used for LED semiconductor chip solidification are all used for single-piece and small-batch production; due to the limitations of technology and design reasons, their performance cannot meet the requirements of high-quality mass production. It mainly has some defects: [0003] 1. The non-selective common heating method of the chip and the bracket is easy to cause thermal damage to the chip, resulting in the failure of the chip function. [0004] 2. The temperature control of the heating system is relatively extensive, and the sampling frequency of the temperature control point is 1KHz; resulting in a large error in the temperature balance of the heating system, and it is impossible to realize multi-point synchronous sharing; it is limited to single...

AI Technical Summary

Problems solved by technology

[0003] 1. The non-selective common heating method of the chip and the bracket is easy to cause thermal damage to the chip, resulting in the failure of the chip function

[0004] 2. The temperature control of the heating system is relatively extensive, and the sampling frequency of the temperature control point is 1KHz; resulting in a large error in the temperature balance of the heating system, and it is impossible to realize multi-point synchronous sharing; it is limited to single-piece production

[0005] 3. No eutectic welding interface wettability process guarantee system, which limits the quality consistency and reliability of eutectic welding

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