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A kind of metal thin film coating bonding quality detection method

A metal thin film and coating technology, applied in the direction of testing material hardness, etc., can solve the problems of cost increase, large load, destructive testing, etc., and achieve the effect of good repeatability, small limitation and small impact

Inactive Publication Date: 2016-10-05
ZTE CORP
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  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The instrument using the Rockwell indenter--the Rockwell hardness tester has a large load. The minimum load used by the common Rockwell hardness tester on the market is 15kgf. Generally, a large indentation will be formed, which will have a significant impact on the overall appearance of the sample. It belongs to destructive testing;
[0007] In addition, the indentation depth of the sample is relatively deep. In order to ensure that no bending deformation occurs during the loading process of the sample and affect the test results, according to the requirements of the indentation method, the thickness of the substrate is required during the test, and the indentation depth is required to be less than 1 / of the sample thickness. 10, so the Rockwell indentation method is suitable for large samples but not suitable for measuring thin materials below 1mm or small-sized samples, products with complex shapes, etc.;
[0008] If you want to change these defects, you need to use a special loading system to reduce the loading load, and you need to use special instruments and equipment, which greatly increases the cost of implementing this test method, and the economical practicability is low.

Method used

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  • A kind of metal thin film coating bonding quality detection method
  • A kind of metal thin film coating bonding quality detection method
  • A kind of metal thin film coating bonding quality detection method

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Embodiment Construction

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] Embodiments of the present invention provide a method for detecting the bonding quality of metal thin film coatings, such as figure 2 Shown is the schematic diagram of coating bonding quality testing. Use the Vickers hardness tester to press the Vickers indenter into the surface of the coating with a preset load. The indenter penetrates the coating and presses into the surface of the substrate to cause mechanical deformation of the coating and the substrate. When there is residual stress between the coating and the substrate, When there are def...

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Abstract

The invention relates to metal coating technology, and provides a method for detecting the bonding quality of a metal thin film coating, comprising: using a Vickers hardness tester to carry out indentation loading on a sample to be tested; comparing the observed coating morphology with a reference map Compare and evaluate the bonding quality level of the coating. Adopting the technical solution of the present invention, there is little restriction on the size, which is suitable for the research and judgment of the coating bonding quality of thin materials and small-sized samples, and can also test large-sized samples; the Vickers indenter is used to load the sample, and the Vickers indenter can be used to load the sample. Hardness test can realize near non-destructive test without affecting the overall appearance of the product; using Vickers hardness tester for indentation test can precisely control the load size, loading speed, and load holding time, which are less affected by the test conditions. Repeat well; finally, this scheme can be tested directly with a standard micro-microhardness Vickers hardness tester, which is easy and quick to operate, does not need to use special instruments, is economical and practical, and has good versatility.

Description

technical field [0001] The invention relates to metal coating technology, in particular to a metal thin film coating bonding quality detection method. Background technique [0002] The metal and plastic casings used in electronic products today generally undergo surface treatment in order to increase their aesthetics, corrosion resistance and wear resistance. Electroplating, chemical plating, and thin film technologies such as PVD and CVD have been applied to the casings of consumer electronics. Wide range of applications where the bonding quality of the thin film coating is critical to the reliability of the product surface. [0003] In the past, the evaluation methods of the bonding quality of the coating were mainly based on the scratch method and the 100-grid method. These methods are limited by the test conditions and personnel operations, such as the depth and uniformity of the scratches, and the bonding effect of the 100-grid tape. The repeatability is poor, and ther...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/42
Inventor 郑镇嵘宋好强李二勇
Owner ZTE CORP
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