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Cooling device and electronic device with cooling device

A technology for heat dissipation devices and electronic devices, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of reducing the overall size of the equipment, small volume, etc.

Inactive Publication Date: 2012-05-30
OSRAM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the gradual miniaturization of the volume of today's electronic devices, the volume of the heat sink mounted on the electronic device is also required to be as small as possible, so that the overall size of the entire device can be reduced

Method used

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  • Cooling device and electronic device with cooling device
  • Cooling device and electronic device with cooling device
  • Cooling device and electronic device with cooling device

Examples

Experimental program
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Effect test

Embodiment Construction

[0021] Figures 1 to 3 Three different embodiments of heat sinks according to the prior art are shown. exist figure 1 In the shown first embodiment, a plurality of heat sinks 2 are arranged on a rectangular heat conduction base 1 , and these heat sinks 2 stand vertically on the heat conduction base 1 in parallel with each other at a certain distance. The heat sink 2 can be integrally formed with the heat conduction base 1 , and of course they can also be formed separately. from figure 1 It can be seen from the figure that these heat sinks 1 are all flat heat sinks.

[0022] exist figure 2 In the shown second embodiment, a plurality of heat sinks 2 are arranged on the circular heat conduction base 1, and these heat sinks 2 are vertically erected on the heat conduction base 1 in a circle around each other, thereby forming a structure similar to The shape of the lantern, from figure 2 It can be seen from the figure that the heat sinks 1 are all flat heat sinks, and these ...

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Abstract

The invention relates to a cooling device of an electronic device, and the cooling device comprises a heat-conducting base (1) and at least one cooling fin (2) arranged on the heat-conducting base (1). The cooling fin (2) is designed with a corrugated profile, so that the cooling area can be increased while the total size of the cooling device is not increased fundamentally. In addition, the invention also relates to the electronic device with the cooling device.

Description

technical field [0001] The invention relates to a heat dissipation device for electronic devices. In addition, the invention also relates to an electronic device with a heat dissipation device. Background technique [0002] In the prior art, heat sinks are usually used to dissipate heat from electronic devices. This kind of heat sink usually has a base that is in contact with the heat-generating part of the electronic device, and a plurality of flat heat sinks are arranged on the base. According to experiments, under the same external conditions, such as convection conditions, the heat dissipation effect of the heat sink depends entirely on the contact area between the fins on the heat sink and the air, that is, the area of ​​the heat dissipation surface that exchanges heat with the air. The larger the area, the better the heat dissipation effect of the heat sink. In order to obtain a good heat dissipation effect, it is inevitable to increase the size of the heat sink or ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH01L23/467H01L23/3672H01L2924/0002H01L2924/00
Inventor 袁海平戴成龙杨灿邦陈小棉
Owner OSRAM GMBH
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