Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of metamaterial medium substrate

A technology of dielectric substrates and metamaterials, applied in the field of metamaterials, can solve the problem that dielectric substrates do not have electromagnetic modulation function, etc., and achieve the effect of expanding functional applications

Active Publication Date: 2013-07-03
KUANG CHI INST OF ADVANCED TECH +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a fixed substrate for artificial microstructures, the existing dielectric substrate has uniform permittivity and permeability as a whole, so it does not produce a unique response to electric or magnetic fields, that is, for the entire metamaterial, the dielectric substrate also Does not have electromagnetic modulation function

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A method for preparing a metamaterial dielectric substrate, the dielectric substrate adopts a porous ceramic substrate, comprising the following steps:

[0027] a. Prepare polyvinylidene fluoride solutions with mass fractions of 0.3%, 0.6%, 1%, and 2%, and use N,N-dimethylacetamide as the solvent;

[0028] b. Form a layer of 0.3% polyvinylidene fluoride solution liquid film on the porous ceramic substrate by scraping the film, and the polyvinylidene fluoride solution penetrates into the porous ceramic substrate;

[0029] c. Put the porous ceramic substrate in an oven and dry it at 60°C, so that the vinylidene fluoride infiltrated into the porous ceramic substrate is cross-linked at high temperature to form a vinylidene fluoride resin, and the solvent is volatilized;

[0030] d. Set a back-shaped mold on the dried porous ceramic substrate, and add a polyvinylidene fluoride solution with a mass fraction of 0.6% in the back-shaped mold to form a back-shaped polyvinylidene ...

Embodiment 2

[0036] A method for preparing a metamaterial dielectric substrate, the dielectric substrate adopts a porous ceramic substrate, comprising the following steps:

[0037] a. prepare polysulfone solutions with mass fractions of 0.2%, 0.4%, 0.8%, and 1%, and use nitrogen-nitrogen dimethylformamide as the solvent;

[0038] b. forming a layer of polysulfone solution liquid film with a mass fraction of 1% on the porous ceramic substrate by scraping the film, and the polysulfone solution penetrates into the porous ceramic substrate;

[0039] c. Put the porous ceramic substrate in an oven and dry it at 75°C, so that the polysulfone infiltrated into the porous ceramic substrate is cross-linked at high temperature to form a vinylidene fluoride resin, and the solvent is volatilized;

[0040] d. A mold is set on the dried porous ceramic substrate, and a polysulfone solution with a mass fraction of 0.8% is added into the mold to form a circular polysulfone solution liquid film in a local are...

Embodiment 3

[0046] A method for preparing a metamaterial dielectric substrate, the dielectric substrate adopts a porous composite ceramic metal substrate, comprising the following steps:

[0047]a. prepare polyethersulfone solutions with mass fractions of 0.1%, 0.3%, 0.5%, and 1%, and use nitrogen nitrogen dimethylformamide as the solvent;

[0048] b. Place the porous composite ceramic metal substrate on the substrate of the flat-plate scraping machine, then add polyethersulfone solution on the porous composite ceramic-metal substrate and then scrape the film through the flat-plate scraping machine. A layer of polyethersulfone solution liquid film with a mass fraction of 0.1% is formed on the ceramic substrate, and the polyethersulfone solution penetrates into the porous composite ceramic metal substrate;

[0049] c. Place the porous composite ceramic-metal substrate in an oven and dry it at 70°C, so that the polyethersulfone infiltrated into the porous composite ceramic-metal substrate i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a preparation method of a metamaterial medium substrate; by adding organic solutions with different mass fractions into different areas of a porous material substrate and by the high temperature crosslinking of the organic solutions, a molded metamaterial medium substrate contains organic polymers with different masses at different areas; thereby the metamaterial medium substrate has heterogeneous dielectric constant distribution, which provides the metamaterial medium substrate with a specific electromagnetic modulation function; and the function application of the metamaterial is expanded.

Description

【Technical field】 [0001] The invention relates to the field of metamaterials, in particular to a process for preparing a dielectric substrate of a metamaterial. 【Background technique】 [0002] Metamaterials are generally composed of multiple metamaterial functional plates stacked or combined according to other regular arrays. The metamaterial functional plate includes a dielectric substrate and multiple artificial microstructures arrayed on the dielectric substrate. The existing metamaterial dielectric substrate is a uniform material. Advanced organic resin substrates, such as FR4, TP1, etc., generally adopt the existing PCB processing technology. [0003] For metamaterials, since the multiple artificial microstructures arrayed on the dielectric substrate have specific electromagnetic properties, they can generate electromagnetic responses to electric or magnetic fields. Therefore, through the precise design and control of the structure and arrangement of the artificial micr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/24B32B18/00B32B27/06B32B27/30
Inventor 刘若鹏赵治亚缪锡根张影
Owner KUANG CHI INST OF ADVANCED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products