Built-in testing method for delay of trigger and circuit

A technology with built-in test circuits and triggers, which is applied in the measurement of electricity, measurement of electrical variables, and digital circuit testing. System final frequency and other issues

Active Publication Date: 2012-05-23
HUADA SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The delay of the flip-flop not only directly affects the final frequency of the overall system, but if its precise value cannot be obtained at the early stage of design, it will seriously affect the robustness of the final chip
[0004] But today's integrated circuit manufacturing process continues to improve, and the delay of a single flip-flop has been reduced to hundreds of picoseconds (10 -12 ) magnitude, the delay parameter of the trigger has to be obtained through software simulation, although there is still a big gap between the result of software simulation and the tape-out result of the actual chip
Because first of all, it is difficult for ordinary test instruments to accurately measure the delay of the picosecond level, and secondly, the error of the delay from the inside of the chip to the test pin can be compared with the delay of the trigger to be tested

Method used

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  • Built-in testing method for delay of trigger and circuit
  • Built-in testing method for delay of trigger and circuit
  • Built-in testing method for delay of trigger and circuit

Examples

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Embodiment 300

[0023] figure 1 A circuit embodiment using a ripple carry counter 100 to accumulate the delay of the flip-flop under test is shown. The QN output terminal of the flip-flop 101 is connected to its own D input terminal by means of feedback, and QN is used as the clock input terminal of the next-stage flip-flop 102 . By analogy, n identical flip-flops to be tested are cascaded to form a ripple carry counter.

[0024] figure 2 The working waveform diagram of the ripple carry counter 100 is shown. When the reset signal RST turns to the active state 211, the output terminals QN of the flip-flops under test 101 to 10n are reset to high level, and the output terminal Q is reset to low level. At this time, the outputs C1 to Cn of the ripple carry counter 100 are all low level, that is, decimal 0. When the reset signal RST is turned into an invalid state 212, driven by the rising edge 201 of the clock CLK, the flip-flop 101 to be tested samples QN1 (high level), so that C1 turns to...

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Abstract

The invention provides a built-in testing method for the delay of a trigger. The method comprises the following steps of: accumulating the delay of triggers to be tested, and comparing the delay with a period of a reference clock to generate a detection signal determined by the comparison; converting the detection signal, and then outputting the detection signal so that the detection signal can be directly observed from the outside of a chip; and determining the accumulated delay of the triggers to be tested through continuously changing the period of the reference clock and detecting the change of an observable signal, and finally, calculating the precise delay of a single trigger to be tested. In addition, the invention also provides a built-in testing system for the delay of the trigger. The system consists of an adjustable clock generator, a trigger delay accumulation circuit, a delay comparison circuit and an observable signal generation circuit.

Description

technical field [0001] The present invention relates to the test of digital integrated circuit, more specifically, relates to the method and circuit for the built-in test on the delay of the flip-flop on the chip. Background technique [0002] In the existing digital integrated circuit design, synchronous design is the most important design strategy. For synchronous digital circuits, the flip-flop unit is an extremely important component. The delay, power consumption, area, and reliability of the flip-flop directly determine the design difficulty, product performance, and market success rate of the integrated circuit chip. [0003] At the same time, as the market's requirements for chip functions continue to increase, the scale of digital integrated circuits continues to increase. Using an automated design process based on standard cells has become the best choice for digital integrated circuit designers. This requires accurate characteristic parameters of various standard...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/317G01R31/3177
Inventor 马纪丰梁浩
Owner HUADA SEMICON CO LTD
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