Probe card and test method

Abstract

The invention discloses a probe card and a test method. The probe card integrates multiple probes with different strokes. The multiple probes with the different strokes can contact connecting points at different heights when facing to the connecting points at the different heights on an object to be tested, so that the object to be tested can be tested. In addition, the test method employing the probe card is also disclosed.

Description

technical field [0001] The invention relates to a test device and a test method, and in particular to a probe card suitable for testing semiconductor components and a test method using the probe card. Background technique [0002] The electrical test of an integrated circuit chip (IC chip) is very important in each stage of a semiconductor process. Each IC chip must be tested in wafer and package form to ensure its electrical function. [0003] Wafer test (wafer test) is to make the test machine and probe card (probe card) form a test circuit, the probe (probe pin) on the probe card is directly connected to the pad (pad) or bump (bump) on the wafer ) contact, to use the probe to detect each chip on the wafer, thereby leading to the chip signal, and sending the chip signal data to the test machine for analysis and judgment. In this way, before the packaging step, chips with poor electrical properties and functions can be filtered out in advance, so as to avoid increasing th...

AI Technical Summary

Problems solved by technology

In this way, the testing process is relatively complicated and relatively increases the burden on the manufacturing process

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