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Device for measuring temperature of grinding area during plane grinding

A technology of temperature measurement and surface grinding, which is applied in the direction of measuring devices, grinding machine parts, thermometers, etc., can solve problems such as difficulty in achieving the best results, optimize surface grinding process parameters, and improve workpiece grinding surface quality and the effect of grinding efficiency

Inactive Publication Date: 2012-04-04
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to avoid the above phenomenon, the current surface grinding process mostly relies on the experience of the operator to select the processing parameters for grinding, and it is difficult to achieve the best effect

Method used

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  • Device for measuring temperature of grinding area during plane grinding
  • Device for measuring temperature of grinding area during plane grinding
  • Device for measuring temperature of grinding area during plane grinding

Examples

Experimental program
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Embodiment Construction

[0012] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0013] Such as figure 1 , figure 2 Shown, the grinding zone temperature measuring device of surface grinding of the present invention comprises constantan sheet 2, mica sheet 3, wire 4. Wire 5. Acquisition card 7, computer 9, etc.

[0014] Such as figure 1 As shown, the measurement sensor part is made of wire 4 and wire 5 Connect the two ends of the conductor grinding workpiece 1 of different materials and the thermocouple material constantan sheet 2, and insulate the grinding workpiece (1) and the constantan sheet) with a mica sheet 3 . In the experimental grinding process, the wire was first 4 and wire 5. Insert the acquisition card 7 and the computer 9 with the cold junction compensation (CJC) function, and then set the speed of the grinding wheel 10 to be V s and table 6 speed is V w Carry out grinding experiment processing. Once th...

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Abstract

The invention relates to a device for measuring the temperature of a grinding area during plane grinding. The device comprises a constantan sheet, a mica sheet, an acquisition card and a computer. The device is characterized in that: the constantan sheet and the mica sheet are arranged in grooves on side faces of a grinding workpiece; and the grinding workpiece and the constantan sheet are respectively connected with the computer by using the acquisition card through leads I and II. The device has the advantages that: by using a thermocouple principle, both ends of two conductors with different components are connected into a loop, when the thermocouple temperatures of two connection points are different, an electromotive force can be generated in the loop, and a temperature value which corresponds to the electromotive force generated by thermocouple can be displayed by using a corresponding instrument; the temperature of the grinding area during grinding of the grinding workpiece by using a plane grinding machine can be tested; parameters of a plane grinding process are optimized; and great significance is provided for improvement of the surface quality and grinding efficiency of the grinding workpiece.

Description

technical field [0001] The invention relates to a temperature measuring device, in particular to a grinding area temperature measuring device used for surface grinding. Background technique [0002] In the precision grinding process, the temperature in the grinding zone has a great influence on the surface quality of the machined parts and the cutting performance of the abrasive grains of the grinding wheel. When the temperature in the grinding zone is high, the metallographic structure of the surface layer of the part will change, resulting in grinding burns. The higher instantaneous temperature in the grinding area will form thermal stress during the grinding and cooling process, which will cause greater residual stress on the surface of the ground part, and even cause cracks on the surface. In order to avoid the occurrence of the above phenomenon, the current surface grinding process mostly relies on the experience of the operator to select the processing parameters for ...

Claims

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Application Information

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IPC IPC(8): B24B49/14G01K7/04
Inventor 迟玉伦李郝林
Owner UNIV OF SHANGHAI FOR SCI & TECH
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