High heat conduction and high attenuation backing material for ultrasonic phased array probe and manufacturing method thereof

Abstract

A high heat conduction and high attenuation backing material for ultrasonic phased array probe is made from lutecium oxide, alumina, a tungsten compound material and an epoxy adhesive and is characterized in that the epoxy adhesive is prepared by mixing epoxy resin E-54 and triethanolamine; the tungsten compound material is prepared by mixing rubber and a tungsten powder; and the alumina accounts for 10.48-53.04wt% of the backing material. A manufacturing method of the backing material comprises the following steps of: (a) mixing the epoxy resin E-54, lutecium oxide, alumina and the tungsten compound material with stirring, wherein the epoxy resin E-54 accounts for 6.22% the total weight of the backing material and alumina accounts for 10.48-53.04wt% of the backing material; (b) adding triethanolamine which accounts for 0.95% the total weight of the backing material into the above composite particles with stirring; (c) putting the composite particles into a die, and extruding the composite particles into the required backing material by the use of a powder pressing machine; and (d) putting the pressed backing material into an air-blasting heating oven of 65 DEG C for heating-curing. The thermal conductivity of the backing material is 1.782W / (m.k), its specific acoustic impedance is 8.42*106Pa.s / m and its acoustic attenuation coefficient at 5MHz is 294.4dB / cm. The backing material has high thermal conductivity and high attenuation. In addition, the sensitivity and resolution of the phased array probe produced by the use of the backing material can satisfy the requirement for application.

Description

Technical field [0001] The invention relates to a backing material with high thermal conductivity and high attenuation for ultrasonic phased array probes and a manufacturing method thereof. Background technique [0002] Using the ultrasonic phase array probe at high sound intensity or for a long time continuously will cause the internal components of the transducer to become too hot, which will have a great impact on the performance and detection results of the probe, and even affect the probe Life. Since the criteria for selecting transducer elements are based on their acoustic performance, the thermal conductivity of transducer elements with excellent acoustic performance is usually relatively low. In addition, the transducer elements are often isolated from each other by cutting slots, which provides additional thermal insulation for the transducer elements. In this way, the heat generated in the transducer element is enclosed in the acoustic stack and is difficult to radiat...

AI Technical Summary

Problems solved by technology

Since the backing material of the present invention has the characteristics of high thermal conductivity, high attenuation and relatively low acoustic impedance, using the ultrasonic phased array probe made of the backing material solves the problem of When working, due to the low thermal conductivity of the backing material, the heat is difficult to dissipate, resulting in the problem that the transducer is prone to overheating; and the ultrasonic phased array probe can well meet people's requirements for the sensitivity and resolution of the probe. Require

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