LED (Light-Emitting Diode) light source module

A technology of light-emitting diodes and light source modules, applied in the direction of light sources, electric light sources, point light sources, etc., can solve problems such as color fading, shorten the service life of light-emitting diode packages, and poor heat dissipation of light-emitting diode packages, so as to avoid color fading , prolong the service life, improve the effect of luminous quality

Inactive Publication Date: 2012-01-25
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this kind of light emitting diode package, because the phosphor powder is in direct contact with the light emitting diode chip, the heat generated by the light emitting diode chip will cause the phosphor powder to overheat and cause color fading of the finally emitted light, thereby affecting Luminous Quality of LED Packages
Moreover, the coating of the light-emitting diode chip by phosphor powder will lead to poor heat dissipation of the light-emitting diode package, thereby shortening the service life of the light-emitting diode package

Method used

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  • LED (Light-Emitting Diode) light source module
  • LED (Light-Emitting Diode) light source module
  • LED (Light-Emitting Diode) light source module

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Embodiment Construction

[0023] Such as figure 1 As shown, the LED light source module 1 provided by the embodiment of the present invention includes a substrate 10 , a LED package 12 , a lens 14 and a phosphor 16 . The LED package 12 is fixed on the substrate 10 . The lens 14 is glued on the substrate 10 to cover the LED package 12 . The fluorescent powder 16 is coated on the surface of the lens 14 . The light emitted by the LED package 12 is converted into light of a specific wavelength by the phosphor powder 16 when passing through the lens 14 and radiated outward.

[0024] A transmission circuit (not shown) is arranged on the substrate 10 . The LED package 12 is mounted on the substrate 10 by means of flip-chip or wire connection, and is electrically connected to the outside through the substrate 10 .

[0025] The lens 14 is a concave hollow hemisphere. It can be understood that the lens 14 can also be implemented in other shapes according to light distribution requirements. The lens includes...

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Abstract

The invention provides an LED (Light-Emitting Diode) light source module, which comprises a substrate, an LED packaging body, a lens and fluorescent powder, wherein the LED packaging body is fixedly arranged on the substrate and is electrically connected with the outside through the substrate. An inner concave accommodation space is formed in the lens and is fixedly arranged on the substrate for sealing the LED packaging body in the accommodation space. The fluorescent powder is coated on the surface of the lens. The light emitted by the LED packaging body is converted into light with a specific wavelength by the fluorescent powder coated on the lens in the process of penetrating through the lens; and the light is radiated outwards.

Description

technical field [0001] The invention relates to a light emitting diode light source module. Background technique [0002] Existing light-emitting diode packages generally emit light of various colors by exciting phosphor powder coated on the surface of the light-emitting diode chip. However, in this kind of light emitting diode package, because the phosphor powder is in direct contact with the light emitting diode chip, the heat generated by the light emitting diode chip will cause the phosphor powder to overheat and cause color fading of the finally emitted light, thereby affecting Luminous quality of LED packages. Moreover, the coating of the light-emitting diode chip by phosphor powder will lead to poor heat dissipation of the light-emitting diode package, thereby shortening the service life of the light-emitting diode package. Contents of the invention [0003] In view of this, it is necessary to provide an LED light source module that can avoid color fading and impr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V13/00F21Y101/02
Inventor 陈志隆
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC
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