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cpu interconnection device

An interface module and data technology, applied in the electronic field, can solve problems such as high cost, poor scalability, and long data transmission delay, and achieve the effects of strong flexibility, reduced data transmission delay, and high scalability

Active Publication Date: 2011-12-28
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a CPU interconnection device, which is used to solve the defects of poor scalability, long data transmission delay and high cost of the existing inter-CPU interconnection system

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0028] Figure 1A It is a schematic structural diagram of a CPU interconnection device provided by an embodiment of the present invention. The CPU interconnection device in the embodiment of the present invention may be realized by using a Field Programmable Gate Array (Field Programmable Gate Array, FPGA for short). Such as Figure 1A As sh...

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Abstract

The present invention provides a CPU (Central Processing Unit) interconnecting device comprising: a QPI (Quick Path Interconnect) interface module which is connected with a QPI interface of the CPU and used for converting serial QPI data sent by the CPU into parallel QPI data; a SerDes (Serial Deserial) interface module which is respectively connected with the QPI interface module and the other SerDes interface module, and used for receiving the parallel QPI data output by the QPI interface module and converting the parallel QPI data output by the QPI interface module into high-speed serial SerDes data, then sending the high-speed serial SerDes data to the other SerDes interface module; the other SerDes interface module which is arranged on the other CPU interconnecting device; wherein the SerDes interface module is also used for receiving the high-speed serial SerDes data sent by the other SerDes interface module and converting the received high-speed serial SerDes data into the parallel QPI data; and the QPI interface module is also used for converting the parallel QPI data output by the SerDes interface module into the serial QPI data and sending the serial QPI data to the CPU.

Description

technical field [0001] The embodiment of the present invention relates to electronic technology, and in particular to a CPU interconnection device. Background technique [0002] The interconnection between the CPUs is realized by the full direct connection of the PCB boards of IBM. Each IBM Power CPU comes with 7 high-speed interconnection ports, which can be interconnected with 7 Power CPUs at the same time. 8 Power CPUs can form an 8P system through full direct connection. But because the Power CPU integrates the function of the NC controller, the cost is relatively high. Limited by the number of Power CPU interconnection ports, the CPU system composed of Power CPUs has poor scalability and low flexibility. [0003] HP uses NC node controllers and switch modules to realize the interconnection between CPUs, and the system of the entire interconnection architecture is complex. In this solution, two chips are added to the whole system to realize the functions of NC node c...

Claims

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Application Information

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IPC IPC(8): G06F15/163
CPCG06F13/4059G06F13/40G06F15/17G06F13/4282G06F13/4265G06F2213/0038G06F2213/3852
Inventor 常胜杨荣玉侯新宇
Owner HUAWEI TECH CO LTD
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