Pressing film method of flexible printed circuit

Abstract

The invention provides a pressing film method of a flexible printed circuit. The method comprises the following steps: smearing a thin layer of water with a wet cloth on a material to be pressed with a film, sending the material into a pressing film device, and pressing a photosensitive film on the material by an upper roller and a lower roller. Since a surface of the material has a thin layer of water before pressing film, the thin layer of water just fills uneven points of the material surface, there is no air bubbles between the material and the film, thus after pressing the film, a line made of the material will not be disconnected. Technical effect of the invention is that: a bubble problem in a pressing film process caused by an uneven surface of a material is eliminated, and a line disconnection problem of a produced line caused by the above problem is eliminated too, thus a rate of good product is greatly raised.

Description

technical field [0001] The invention relates to the manufacture of flexible circuit boards, in particular to a lamination method for flexible circuit boards. Background technique [0002] Flexible circuit boards (also known as soft boards) are widely used in the connection parts of electronic products, such as mobile phone cables, liquid crystal modules, etc. In the initial process of manufacturing flexible circuit boards, a layer of photosensitive film needs to be pressed on the material. The process is called lamination. First, a layer of photosensitive film is pressed on the surface of the material. This layer of photosensitive film is initially semi-liquid. The existing technical solution for flexible circuit board lamination is to use the upper and lower rollers to press the photosensitive film on the material at a temperature of 95°±°C, a speed of about 1.5 m / min, and a pressure of about 50 psi, and then press the film The final material is taken to be exposed. This ...

AI Technical Summary

Problems solved by technology

The existing technical solution for flexible circuit board lamination is to use the upper and lower rollers to press the photosensitive film on the material at a temperature of 95°±°C, a speed of about 1.5 m / min, and a pressure of about 50 psi, and then press the film The final material is taken to be exposed. This lamination method has the following problems: because there are more or less uneven spots on the surface of the material, and there are via holes for double-layer or multi-layer boards, and the edges of the via holes are also uneven. Convex points, so that there will be air bubbles in the uneven parts when pressing the film. These air bubble points will be disconnected points after the material is made into a circuit, resulting in poor product function.

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