Proximity exposure device, carrying stage temperature control method and manufacturing method for panel substrate
An exposure device and a technology for carrying substrates, which are applied in photolithographic process exposure devices, microlithography exposure equipment, semiconductor/solid-state device manufacturing, etc., can solve problems such as inconvenience, reduced accuracy of pattern burning, and general products without suitable structures. , to achieve the effect of reducing the temperature change and the burning of the pattern with good precision
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[0052] In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the adjacent exposure device, stage temperature control method and panel substrate manufacturing method proposed according to the present invention will be described below. Its specific implementation, structure, feature and effect thereof are described in detail as follows.
[0053] figure 1 It is a figure which shows the schematic structure of the proximity exposure apparatus which concerns on one Embodiment of this invention. and, figure 2 is a side view of an adjacent exposure apparatus according to an embodiment of the present invention, image 3 It is a front view of the proximity exposure apparatus which concerns on one Embodiment of this invention. The adjacent exposure device includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage ...
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