Improved copper-clad aluminum wire and preparation method thereof

Abstract

The invention discloses an improved copper-clad aluminum wire. The improved copper-clad aluminum wire comprises an aluminum wire substrate and a copper layer, wherein the copper layer is wrapped on the outer surface of the aluminum wire substrate; a dual-metal layer which is formed through interatomic metallurgical bonding is formed between the copper layer and the aluminum wire substrate; grooves are formed on the outer surface of the aluminum wire substrate at intervals; and the copper layer is embedded in the grooves of the aluminum wire substrate. The improved copper-clad aluminum wire has a reasonable structure and is novel in preparation method; the copper and aluminum bonding strength of a copper-clad aluminum wire product is high; and in a practical using process, the phenomena that the copper and aluminum are separated, the copper layer cracks and bulges, and the like, do not appear, so the improved copper-clad aluminum wire is normally used and has good popularization value and market value.

Description

technical field [0001] The invention relates to a composite material and a preparation method thereof, in particular to an improved copper-clad aluminum bar and a preparation method thereof. Background technique [0002] As a substitute for pure copper bars, copper-clad aluminum bars are a new type of conductive material, which can reduce the cost of copper bars by half with the same current carrying capacity, and can effectively save copper resources. see figure 1 , the cross-sectional structure of the existing copper-clad aluminum row is that a layer of copper is coated on the outer surface of the aluminum row matrix from a macroscopic point of view, and the bonding interface between copper and aluminum is straight; from a microscopic point of view, the cross-sectional structure of copper and aluminum Aluminum forms a bimetal with some degree of interatomic metallurgical bonding. The copper-clad aluminum row with this structure cannot guarantee the bonding strength of co...

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Problems solved by technology

[0005] None of the above-mentioned methods for producing copper-clad aluminum bars can be used to produce the improved copper-clad aluminum bars of the present invention, and the above-mentioned method one and method two basically adopt the solid-phase bonding method, that is, the two metals of copper and aluminum are formed by plastic deformation. The bonding surface is close to the interatomic metallurgical bonding, but this bonding strength is very low; the above-mentioned method three can easily cause the burning of the copper tube, not only the yield and production efficiency are low, but also the energy consumption is high; the thickness of the electroplated copper layer in the above-mentioned method four Limited, and the copper layer is easy to fall off, which cannot ensure the normal operation of the product

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