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Mems sensor

A sensor and substrate technology, applied in the field of MEMS sensors, can solve the problems of easy deviation of plane size, deviation of joint strength, reduction of joint area, etc., and achieve the effects of reducing deviation, improving joint strength and stabilizing joint strength

Inactive Publication Date: 2011-08-17
ALPS ALPINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the portion of the concave region 207a and the connection metal layer 208 are not bonded, the bonding area decreases and the bonding strength decreases.
In addition, the size of the plane of the concave region 207a tends to vary, and the bonding strength varies due to the variation in the bonding area.

Method used

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Examples

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Embodiment Construction

[0068] figure 1 The MEMS sensor showing the embodiment of the present invention is a plan view showing the movable electrode part, the fixed electrode part, and the frame body layer. exist figure 1 In , the illustration of the first substrate and the second substrate is omitted. figure 2 Yes figure 1 Enlarged view of Part II of image 3 It is an enlarged view of Part III. Figure 4 It is a cross-sectional view showing the overall structure of the MEMS sensor, and is equivalent to cutting along line IV-IV figure 1 cross-sectional view. Figure 5 equivalent to Figure 4 An enlarged cross-sectional view of the V portion of . Image 6 With Figure 5 Enlarged cross-sectional views of MEMS sensors of various other embodiments.

[0069] like Figure 4 As shown, the MEMS sensor sandwiches a functional layer 10 between a first substrate 1 and a second substrate 2 . Each part of the first substrate 1 and the functional layer 10 is bonded via the first insulating layers 3...

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Abstract

Provided is an MEMS sensor wherein especially a structure for bonding each supporting conductive section of a movable electrode section and a fixed electrode section, which are supported on a first substrate side, with a lead layer embedded in an insulating layer on the side of a second substrate which faces the first substrate with a space therebetween is improved. The MEMS sensor has a first substrate (1), a second substrate (2), and a functional layer, which is arranged between the substrates and has the movable electrode section, the fixed electrode section and the supporting conductive section. On the surface of the second substrate (2), a second insulating layer (30), a lead layer (35) and a connecting electrode section (32) which is electrically connected to the lead layer and is individually connected to each supporting conductive section are arranged. On the surface of the second insulating layer (30), a recessed section (37) which penetrates to reach even the surface of the lead layer is formed. The connecting electrode section (32) has a recessed region (32a) conforming to the shape of the recessed section (37), and a connecting region (32b) which extends long on the surface of the second insulating layer (30) from one end section in the recessed region. The supporting conductive section (17) and a connecting region (32b) of the connecting electrode section (32) arebonded to each other.

Description

technical field [0001] The present invention relates to a MEMS sensor provided with a movable electrode part and a fixed electrode part, and the movable electrode part and the fixed electrode part are supported with an insulating layer interposed between a first substrate and a second substrate arranged at intervals in the height direction. . Background technique [0002] MEMS (Micro Electro Mechanical Systems: Micro Electro Mechanical Systems) sensors form movable electrode parts and fixed electrode parts by microfabrication of a silicon (Si) substrate constituting an SOI (Silicon on Insulator: silicon on insulator) substrate. This fine sensor is used as an acceleration sensor, a pressure sensor, a vibrating gyroscope, or a micro relay by the operation of the movable electrode portion. [0003] Such a MEMS sensor needs to seal the movable region of the movable electrode part so that the movable electrode part formed of a part of the silicon substrate can operate at a small...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/84G01P15/08G01P15/125
CPCB81B2203/0307B81B2207/07H01L21/84G01P2015/0814G01P15/0802B81B2207/097G01P1/023H01L27/1203B81B7/007B81C2203/036G01P15/125
Inventor 高桥亨牛肠英纪小林洁
Owner ALPS ALPINE CO LTD
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