Probe card and printed circuit board used for same

Abstract

The invention provides a probe card and a printed circuit board used for the same, which are used for promoting the power integrity during testing. The printed circuit board provided by the invention is defined as a welding spot area, a routing area and an input area, wherein the welding spot area comprises a plurality of first power welding pad groups; the input area comprises a plurality of second welding pad groups corresponding to the first power welding pad groups; and each first power welding pad group is insulated from each second welding pad group. The probe card provided by the invention adopts the printed circuit board and is combined with an external wire or an external power plane to obtain the better power integrity.

Description

technical field [0001] The invention relates to a probe card, in particular to a probe card with good power integrity; the invention also relates to a printed circuit board used for the probe card. Background technique [0002] When testing wafers or electronic components, the testing machine can use a probe card as a medium to input test signals from the probe card to a device under test (DUT), and pass through the probe The card returns the test results to the testing machine for subsequent detection and analysis. [0003] Taking wafer testing as an example, limited by factors such as the size and price of the testing machine, semiconductor factories usually can only use testing machines with a limited number and models to test the DUT. Since the test specifications, types, and quantities of the objects to be tested are different from each other, the testing machine cannot meet the test conditions of various processes or different types of objects to be tested when the te...

AI Technical Summary

Problems solved by technology

Since each power plane must use one or more layers for layout in the routing area, the power plane is prone to structural defects due to layer penetration, or the metal wires are densely distributed on the printed circuit board in order to avoid Through the signal solder joints of the printed circuit board, the wiring path of the metal wire is too complicated

Therefore, when the power input from the power pad passes through the power plane in the routing area, a voltage drop or noise interference often occurs, which will affect the integrity of the power supply to the probe, resulting in test errors and further affecting test results.

On the other hand, the power plane is limited by its wiring in the printed circuit board, so the circuit is fixed and the expandability is not good, which cannot meet the diverse testing needs of the client; if you want to increase the number of power planes, you must increase the wiring of the printed circuit board The number of layers is not only difficult in actual operation, but also will increase the overall cost and needs to be solved

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