Grinding head device for grinding silicon core or other crystalline materials

Abstract

The invention discloses a grinding head device for grinding a silicon core or other crystalline materials and relates to the technical field of grinders. The grinding head device comprises a mounting plate (14), a shaft seat (9), a motor (17), a transmission mechanism and grinding wheels. The grinding head device is characterized by further comprising a planet system, wherein the planet system comprises pinions, a large gear (13) and a shaft cylinder (12); the large gear (13) is connected with the mounting plate (14) fixedly; the pinions are meshed with the large gear (13) respectively; the shaft cylinder (12) is connected with the shaft seat (9) through a bearing (1); the pinions are arranged at one end of the shaft cylinder (12); and the grinding wheels are arranged at the other end of the shaft cylinder (12). The grinding head device can meet a requirement of grinding an end head of the silicon core in a hole-type lapping technology; and working efficiency is high.

Description

technical field [0001] The invention relates to the technical field of grinding machines, in particular to a grinding head device applied to grinding machines for grinding silicon cores or other crystal materials. Background technique [0002] At present, silicon core lapping is a very important technology in the process of producing polysilicon by Siemens method. The upper end of the core is opened with a "U"-shaped groove or a "V"-shaped groove, and the end of the horizontal silicon core is lapped at the groove. This overlapping technology has the following two defects: first, the end of the horizontal silicon core forms a line contact with the lap joint of the groove, and the contact surface is too small, resulting in poor contact at the lap joint. The quality of the polysilicon obtained here is relatively poor, which is called "bending material" in the jargon; second, the horizontal silicon core can be positioned by U-shaped or V-shaped grooves in the front and rear dir...

AI Technical Summary

Problems solved by technology

This overlapping technology has the following two defects: first, the end of the horizontal silicon core forms a line contact with the lap joint of the groove, and the contact surface is too small, resulting in poor contact at the lap joint. The quality of the polysilicon obtained here is relatively poor, which is called "bending material" in the jargon; second, the horizontal silicon core can be positioned by U-shaped or V-shaped grooves in the front and rear directions, but it cannot be positioned in the left and right directions; It is easy to cause the silicon core to fall during the reduction process

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