Electroplating device

Abstract

The invention relates to an electroplating device for electroplating continuously delivered flexible substrates. The electroplating device comprises a sending wheel, a coiling wheel, an electroplating tank containing electroplating solution, a plurality of conductive delivery wheels and a plurality of anode plates, wherein the sending wheel and the coiling wheel are both arranged outside the electroplating tank; the plurality of delivery wheels and the plurality of anode plates are all arranged in the electroplating tank; the plurality of anode plates and the plurality of conductive delivery wheels are all immersed in the electroplating solution; the sending wheel is used for sending the flexible substrates to the electroplating tank; the plurality of delivery wheels are used for delivering the flexible substrates sent by the sending wheel to the coiling wheel by rotation and conducting power to the delivered flexible substrate; the plurality of anode plates are basically arranged in parallel; the flexible substrates are delivered between the neighboring two anode plates when being delivered by the two delivery wheels; and the coiling wheel is used for coiling the electroplated flexible substrates from the plurality of delivery wheels.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device which can save space and improve electroplating uniformity and electroplating efficiency. Background technique [0002] Electroplating refers to a surface processing method that uses an electrolytic device to reduce the anode metal ions in the salt electroplating solution including the anode metal to simple metal by using the principle of oxidation-reduction reaction, and the simple metal is deposited on the surface of the workpiece to be electroplated to form a coating. The electrolysis device includes an anode connected to the positive pole of the power supply, a cathode connected to the negative pole of the power supply and an electroplating tank for containing electroplating solution. Typically, the anode is an anode metal rod. The anode metal rod is immersed in the electroplating solution for generating anode metal ions and supplementing the ...

AI Technical Summary

Problems solved by technology

Since the circuit board to be plated moves along a straight line, the plating tank is usually designed to be very long to improve the plating efficiency, so the plating device needs to occupy a lot of space

Moreover, the arrangement of the anode plate makes the concentration of cations in the center of the circuit board to be plated away from the anode plate low, which directly leads to uneven coating thickness on the surface of the circuit board to be plated.

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