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Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

一种光学半导体、聚硅氧烷的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决易脱离、下降、固化产物泛黄透光率等问题

Active Publication Date: 2011-07-20
DOW CORNING TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the present inventors have noticed that these curable organopolysiloxane compositions have the following problems: their cured products do not always show high light transmittance; Object-contacting semiconductor components or optical semiconductor components, lead frames, and packages exhibit poor adhesion durability, resulting in easy detachment
However, the inventors have noticed the following problem with this curable organopolysiloxane composition: Since the essential component of this composition is a radial copolymer type adhesion promoter, when used The cured product from this composition undergoes yellowing and a decrease in light transmittance when coating or sealing optical semiconductor elements for long-term use at high temperatures

Method used

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  • Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
  • Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
  • Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0176] Mix the following components until uniform to provide a colorless and transparent curable organopolysiloxane composition with a viscosity of 1500 mPa.s:

[0177] 86.7 parts by weight of linear methyl phenyl polysiloxane terminated with dimethyl vinyl siloxy at both ends of the molecule, wherein viscosity = 3500 mPa.s, and silicon-bonded vinyl content = 1.48 wt%, The content of silicon-bonded phenyl groups in all silicon-bonded organic groups = 44.7 mol%, 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1 The total content of 3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane=2.7wt%;

[0178] 3.0 parts by weight use the following average siloxane unit formula: (PhSiO 3 / 2 ) 0.4 (HMe 2 SiO 1 / 2 ) 0.6 The branched methyl phenyl hydrogen polysiloxane represented by the viscosity=700mPa.s, the content of hydrogen atoms bonded to silicon=0.65wt%, and the silicon-bonded organic groups are all silicon-bonded Phenyl content = 25mol%,

[0179] 10.3 parts by weight of diphenyl po...

Embodiment 2

[0184] Mix the following components until uniform to provide a colorless and transparent curable organopolysiloxane composition with a viscosity of 2130 mPa.s:

[0185] 85.9 parts by weight of linear methyl phenyl polysiloxane terminated with dimethyl vinyl siloxy at both ends of the molecule, wherein viscosity = 3500 mPa.s, and silicon-bonded vinyl content = 1.48 wt%, The content of silicon-bonded phenyl groups in all silicon-bonded organic groups = 44.7 mol%, 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1 The total content of 3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane=2.7wt%;

[0186] 14.1 parts by weight use the following average siloxane unit formula: (PhSiO 3 / 2 ) 0.6 (HMe 2 SiO 1 / 2 ) 0.4 Represented branched methyl phenyl hydrogen polysiloxane, wherein viscosity = 2400mPa.s, and silicon-bonded hydrogen atom content = 0.38wt%, silicon-bonded in all organic groups bonded with silicon Phenyl content = 42.9mol%,

[0187] Platinum / 1,3-divinyl-1,1,3,3-tetramethyl...

Embodiment 3

[0191] Mix the following components to uniformity to provide a colorless and transparent curable organopolysiloxane composition with a viscosity of 2160 mPa.s:

[0192] 55.8 parts by weight of linear methyl phenyl polysiloxane terminated with dimethylvinylsiloxy at both ends of the molecule, wherein viscosity = 3500mPa.s, and silicon-bonded vinyl content = 1.48wt%, The content of silicon-bonded phenyl groups in all silicon-bonded organic groups = 44.7 mol%, 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1 The total content of 3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane=2.7wt%;

[0193] 20.0 parts by weight use the following average siloxane unit formula PhSiO 3 / 2 ) 0.75 (ViMe 2 SiO 1 / 2 ) 0.25 The branched methyl vinyl phenyl polysiloxane represented by the state = solid (25° C.), the content of the vinyl group bonded to silicon = 5.62 wt%, and it is combined with silicon in all organic groups bonded to silicon Bonded phenyl content = 50mol%,

[0194] 24.2 parts by ...

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Abstract

A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole% of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight%, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole% of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.

Description

Technical field [0001] The present invention relates to a curable organopolysiloxane composition, an optical semiconductor element encapsulant (especially an encapsulant, that is, a sealant), especially an encapsulant for optical semiconductor elements, and an optical semiconductor device. The present invention more particularly relates to a hydrosilylation reaction curable organopolysiloxane composition and an optical semiconductor component encapsulant (especially an encapsulant, that is, a encapsulant), especially an encapsulant for optical semiconductor components, so The encapsulants each form a cured product showing high refractive index, high light transmittance, and highly durable adhesion to the substrate. The present invention further relates to an optical semiconductor device in which the optical semiconductor element is sealed, specifically, with a cured product from the aforementioned optical semiconductor element sealant (especially an encapsulant, ie, a sealant), ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C09K3/10H01L23/29
CPCH01L2924/0002H01L2924/09701C08G77/20C08G77/70H01L23/296C08L83/04C08G77/12H01L2924/12044C08L83/00H01L2924/00
Inventor 吉武诚江南博司加藤智子寺田匡庆
Owner DOW CORNING TORAY CO LTD
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