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Seed crystal cutting machine

A cutting machine and seed crystal technology, applied in stone processing tools, manufacturing tools, stone processing equipment, etc., can solve the problems of low efficiency of removing seed crystals, harsh working environment, etc., and achieve the goal of improving efficiency, reducing environmental pollution, and improving quality Effect

Inactive Publication Date: 2011-06-29
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to overcome the inefficiency of the existing seed crystal removal and the poor working environment, the present invention provides a high-efficiency seed crystal cutting machine, which can not only improve the efficiency of seed crystal removal, ensure the quality of processing, but also reduce the pollution to the environment , to improve the working conditions of workers

Method used

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Embodiment Construction

[0023] In conjunction with the accompanying drawings, the present invention mainly relates to the feed device of the multi-knife cutting machine. First, the cam handle 1 is used to drive the cam 2 to rotate, and the positioning cylinder 3 on the cam 2 is connected to the connecting rod 6 by the bolt 4, and the slider is connected by the bolt 5. 7 is connected with the connecting rod 6, and the concave surface module 8 on the slide block is used to clamp the sticky wafer to carry out the excision of the seed crystal. Place the wafer on the reference plane 10, adjust the position of the x-axis reference movable block 11 through bolts 14, 15, 16, so that the seed crystal part is aligned with the grinding wheel blade.

[0024] The following describes the engineering process of the present invention in conjunction with the accompanying drawings: first, the seed crystal of the sticky mound is placed on the reference plane 10 to fix the z-axis direction, and then the tool setting is c...

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Abstract

The invention provides a cutting tool belonging to the machining field, in particular to a seed crystal cutting machine which is a high-efficiency seed crystal cutting machine used for removing seed crystals in quartz crystal wafers. The seed crystal cutting machine comprises a machine frame, a feeding mechanism, a positioning mechanism, a cutting mechanism and the like. The feeding mechanism comprises a cam, a connecting rod and a slide block; the positioning mechanism comprises a reference plane positioned on the slide block, a x-axis movable block and three bolts; and cutting mechanism comprises a motor and a grinding wheel blade. The seed crystal cutting machine utilizes the motor to drive the grinding wheel blade to rotate at a high speed for cutting, so that the seed crystal removing technology is simplified, the production efficiency is improved, the quality of seed crystal removal is improved, equipment is simplified, and the cost and the space resources are saved. The seed crystal cutting machine has higher adaptability for processing different materials.

Description

technical field [0001] The invention belongs to a cutting tool in the field of mechanical processing, in particular to a high-efficiency seed crystal cutting machine for removing a seed crystal (seed) in a quartz wafer. Background technique [0002] Due to its high Q value, low dynamic rate, high sensitivity, high stability and other excellent frequency characteristics, quartz chips are widely used in frequency synthesis, counting, navigation, guidance, fax, computer, communication, and other fields. Especially in the use of national defense and military affairs, its importance is even more evident. [0003] Natural crystals have a thin layer of seed crystals, which have no effect in practical applications, so this part needs to be removed. In the past, the removal of seed crystals was done through the patent No. 96227042.3 quartz crystal multi-knife cutting machine. First complete the cutting, which takes about an hour, then stick a layer of glass on the multi-knife cuttin...

Claims

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Application Information

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IPC IPC(8): B28D1/22
Inventor 王树林周波杨志杰宋志鹏张伟展刘旭
Owner JIANGSU UNIV
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