Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Collaborative design method for power/ground network and layout planning based on pattern matching

A technology of pattern matching and layout planning, applied in computing, electrical digital data processing, special data processing applications, etc.

Inactive Publication Date: 2011-05-18
TSINGHUA UNIV
View PDF3 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Various experimental results show that there are still many problems in the power / ground network in VLSI design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Collaborative design method for power/ground network and layout planning based on pattern matching
  • Collaborative design method for power/ground network and layout planning based on pattern matching
  • Collaborative design method for power/ground network and layout planning based on pattern matching

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0075] Step (1) The computer reads in the initial layout information and the constraint file, which includes three kinds of electrical performance constraints:

[0076] a. Voltage drop constraint, for each power supply pin p of module k i must be satisfied: the voltage value V on this pin pi Greater than or equal to the minimum value V that the module needs to obtain voltage from the power line min,k , for each ground pin p of module k i must satisfy V pi Less than or equal to the maximum voltage V that the module needs to get from the power line max,k; ;

[0077] b. Minimum line width constraint, a connection node n on the power / ground network 1 and n 2 The width of the branch b must be greater than the given minimum width value;

[0078] c. Electromigration constraints, that is, maximum current density constraints, expressed as:

[0079] |V n1 -V n2 |≤ρ·l b σ,

[0080] Among them, V n1 , V n2 node n i1 and n i2 voltage on, l b for connecting node n 1 and n ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a collaborative design method for a power / ground network and a layout planning based on pattern matching, which belongs to the field of integrated circuit computer-aided design. The collaborative design method for the power / ground network and the layout planning based on pattern matching is characterized by comprising the following methods of: firstly, creating a power / ground network pattern table, and storing important information data of preset 112 mesh patterns into the table; secondly, selecting a proper power / ground network for a predetermined layout from the created power / ground network pattern table according to a certain pattern selection mechanism; and thirdly, adopting a method for the incremental layout planning of the power / ground network to achieve the efficient collaborative design of the power / ground network and the layout planning. The collaborative design method for the power / ground network and the layout planning based on pattern matching has the advantages of fastness and easy expansion, and can enlarge the scale of processable chips.

Description

technical field [0001] The collaborative design method of power / ground network and layout planning based on pattern matching belongs to the field of computer aided design of integrated circuits, especially relates to the field of layout planning processing. Background technique [0002] With the increasing design complexity and circuit scale, both hierarchical design and IP models have been widely used. Under this development trend, layout design plays a vital role in the quality of VLSI design. Floorplanning is a very important step in layout design, so the optimization of floorplanning has become an important research hotspot. With the continuous development of SOC design, many researchers have added some inter-module location constraints in the layout planning and design according to the special requirements of performance and reliability. For example, there is a strong interconnection between two modules, which creates an adjacency constraint; in the Bus-based wiring p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/50
Inventor 马昱春周强蔡懿慈李佐渭王晓懿
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products