Lithologic density long-spacing data acquisition and processing thick film circuit

Abstract

The invention relates to a long-spacing signal processing thick film circuit. Most of long-spacing signal processing circuits used at present comprise discrete components, and when a set of components are damaged, the maintenance is always comparatively difficult. The long-spacing signal processing thick film circuit is a rectangular thick film block and comprises 20 acicular pins, which are arrayed in two rows at both sides of the thick film circuit, and a built-in long-spacing signal processing circuit, wherein a long-spacing signal input end is the pin 1 of a thick film; one end of a variable resistor R4 is grounded, and the other end of the variable resistor R4 is connected with the pin 20 of the thick film, together with a sliding end; one end of a variable resistor R9 is connected with the pin 4 of the thick film, together with the sliding end, and the other end of the variable resistor R9 is connected with a pin 10; the pins 14 and 19 of the thick film are connected with a +15V power supply; the pins 3 and 12 of the thick film are connected with a -15V power supply; and the pin 13 of the thick film is the OUT output end of a long spacing signal. The packaged thick film circuit disclosed by the invention has relatively low temperature drift, is easy to maintain and is more suitable for debugging the signal in the actual use.

Description

technical field [0001] The invention relates to a thick-film circuit for collecting and processing long-distance data of lithology density when measuring formation lithology and density. Background technique [0002] The lithology density instrument is an important part of the petroleum logging instrument, and the short source distance signal is the data that the lithology density instrument must measure, so the acquisition and processing of the short source distance signal is an indispensable part of the petroleum logging, and the thick film The circuit is to reduce the difficulty of design and production debugging of the whole circuit. Part of the functional circuits composed of discrete components such as resistors, inductors, capacitors, and semiconductor components are made into smaller templates, and the pins are prepared and packaged with resin. The shape of the larger integrated circuit is assembled on the circuit board of the whole machine as a part, which has the a...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a thick-film circuit for data acquisition and processing of long-source-distance data of lithology density. When the well temperature changes, it affects the sampling accuracy and the device is easily damaged and difficult to maintain.

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