Method for improving structure of conductive adhesive and conductive adhesive

Abstract

The invention discloses a method for improving the structure of a conductive adhesive and the conductive adhesive. The conductive adhesive comprises a plane layer formed by parallelly arranging a plurality of conductive metal wires at fixed intervals, wherein the plane layer is quantitatively coated with an insulating material film to form a conductive metal wire thin film; the two sides of the conductive metal wire thin film are respectively coated with another insulating material (such as silica gel); and at least one end of each conductive metal wire protrudes the surface of the another insulating material in a predetermined length by a method of decomposing silicon molecules with etching liquid. The method has the advantages of quickness, stability, guarantee of strength and low cost.

Description

technical field [0001] The invention relates to the field of conductive adhesive, in particular to a method for improving the structure of the conductive adhesive and the conductive adhesive. Background technique [0002] At present, the soft gold glue (conductive glue for short) used for electric conduction has good toughness, conductivity and shock resistance, as well as the advantages of large variability of finished products and easy and fast assembly. Therefore, conductive adhesives are used more and more widely, and are well received by major manufacturers. [0003] The conductive adhesive is a plane layer with a plurality of flexible metal lines parallel to each other and with a fixed distance. An insulating material film is coated on the plane layer quantitatively so that the insulating material film and the metal line are combined into one. The two sides of the metal wire film are respectively coated with an insulating material (such as silica gel) to a proper thic...

AI Technical Summary

Problems solved by technology

The disadvantages of the electroplating method are: a. The electroplating layer needs to be plated to 0.05mm to 0.1mm, which is difficult, costly, and difficult to control the height; b. The conductive adhesive between the integrated circuit and the PC circuit board is under great pressure and During high-frequency dynamic pressing and releasing, if electroplating is used, the accretion layer is easy to peel off

The disadvantages of the laser glue removal method are: a. The laser takes a long time and costs high; b. The laser is not easy to control the depth, and the energy is too large and it is easy to burn too much, which will cause the aging of the silica gel at a too deep layer, which will deteriorate the physical properties of the silica gel and make the The bond between the conductive metal wire and the silica gel is destroyed and peeled off

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